Uttop Acid Copper Plating Additive

1.Commodity Name
UTTOP ACID COPPER PLATING
 
2.Bath Composition and Working Conditions,
Cupric sulfate                    200 ~ 220 g/L
Pure sulfuric acid                  55 ~70 g/L
Chloride ion                     70 ~ 120mg/L
Make-up agent UTTOP-MU         6~8ml/L
Brightener UTTOP-A              0.4~0.6ml/L
Brightener UTTOP-B              0.4~0.6ml/L
Temperature                      20~35 °C
Cathode current density             1~6 A/dm²
Anode current density              0.5~2.5 A/dm²
Anode                      phosphorous copper anode
                           (0.03~0.06% phosphorous)
Electric voltage                    1.5~6 V
Agitation               air agitation or mechanical agitation
Consumption:
Make-up agent UTTOP-MU         30~80ml/1000A.H
Brightener UTTOP-A              60~100ml/1000A.H
Brightener  UTTOP-B             30~80ml/1000A.H
 
3.Application and Advantage,
1. Excellent brightening and leveling, good leveling in LCD area.
2. Good covering, so that the LCD area seldom be nigrescent or misty.
3. The bath solution is stable and is easily controlled.
4. The plating layer has well flexility, corrosion resistance, no pinhole and hard spots.
5. The plating layer is clear. It can be used specially in low copper plating layer, such as silver plating and gold imitation plating, etc.