Thermal Shock Testing Equipment for Electronic Devices

Thermal Shock Testing Equipment

Thermal Shock Testing Equipment Application:
Thermal Shock Testing Equipment is used to test the capability of material structure or composite materials to withstand the continuous environmental changes between extremely high temperature and low temperature during a short period, and therefore understand the chemical changes or physical damages caused by expansion from heat and contraction from cold in the shortest possible time. It is applicable to metals, plastic, rubber, electronics amongst other materials. The test result can be used as a reference or basis for product improvement.

Thermal Shock Testing Equipment Features:
1. It is divided into three zones: High temperature zone, low temperature zone, and testing zone. The test sample is in static mode.
2. Using touch-control graph control as operation interface, easy to operate.
3. Applying wind route conversation to the shock method to distribute temperature to the testing zone for cold and thermal shock measurement.
4. For high temperature shock or low temperature shock, max. Time is up to 999H, and max. Circulation cycles are 9999 times.
5. The system can be used for automatic Circulation Shock or manual selective shock.
6. Adopt binary cooling system, with quick cooling effect. Cooling method is water cooling.
7. Can entering normal temperature. RS-232 and RS-485 communication.

Thermal Shock Testing Equipment Technical Parameters: