Super Bright 3mm Green LED Clear Lens
Super Bright 3mm Green LED Clear Lens
Super Bright 3mm Green LED Clear Lens
Super Bright 3mm Green LED Clear Lens
Super Bright 3mm Green LED Clear Lens
Super Bright 3mm Green LED Clear Lens
Super Bright 3mm Green LED Clear Lens

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Super Bright 3mm Green LED Clear Lens

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Model No. : 304LGC52D7L12
Brand Name : Best LED
Lens size of LED Lamps : 3mm Round Top
Lens type of 3mm green LED : Clear Lens
Angle : 20 Degree
Emitting color : Green
Green LED Voltage : 2.7-3.4v
Brightness : 4000-4500mcd
Brightness level of 3mm green LED : Super Bright
LED Wavelength : 520nm
Pins length : 29mm & 27mm
Chip material : Ingan
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7yrs

Shenzhen, Guangdong, China

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Product description

3mm Green Through-hole LED with 20 degree clear lens:

Are you looking for some mini LED lamps with super brightness green LED? Please check with this 304LGC52D7L12, we produce it with famous brand Epistar chip and gold wire inside for circuir connection. Different with 5mm green through-hole LED, we produce this 3mm LED with smaller clear lens, which can make this 520nm LED have smaller install space. Compare with the diffused lens type, this clear lens will make sure this green LED got much more brightness(twice brightness) and longer radiation emitting. If your project need some LED with super brightness light and long radiation. Please contact us for more detail about this Super Bright LED Lamps.304LGC52D7L12 3mm Green LED 20 degree


3mm Green LED with Clear Lens Size:

304LGC52D7L12 3mm Green LED Clear lens size


Green Through-hole LED Features: 

* Dimension of Lens: 3mm;

* Wavelength 520-530nm;

* Lens type: Clear;

* High reliability and high radiation intersity;



Electrical Parameters:

Parameter Symbol Rating Unit
Power Dissipation Pd 60 mW
Pulse Forward Current IFP 100 mA
Forward Voltage IF 25 mA
Reverse Voltage VR 5 V
Junction Temperature Ti
100
Operating Temperature Topr
-40 ~ +80

Storage Temperature Range Tstg -40 ~ +80
Soldering Temperature Tsol 260
Electro-Static-Discharge(HBM) ESD 1000 V
Service life under normal conditions Time 50000 H
Warranty
Time 2 Years
Antistatic bag Piece 1000 Bag

* Pulse forward current condition: Duty 1% and pulse width=10us.

* Soldering condition: Soldering condition must be completed with 3 secongds at 260℃


Electrucal Optical Characteristics(Tc=25)

Parameter Sysmblo Min Typ max Unit Test Conditin
Forward Voltage VF 2.7 3.0 3.4 V IF=20mA
Luminous Intensity IV 4000
4500 mcd IF=20mA
Peak Wavelength λP

520
nm IF=20mA
Dominant Wavelength λD
520 530 nm IF=20mA
Half Width λ

18
nm IF=20mA
Viewing Half Angle 2θ1/2

20
deg IF=20mA
Reverse Current IR

5 uA VR=5V

*Luminous Intensity is measured by ZWL600.

*θ1/2 is off-sxis angle at which the luminous intenity is half the axia luminous intensity;


Green LED Applications


Manufacturing progress of through-hole LED: 

Compare with SMD LED, through-hole LED production will be more complicated. Which means it will take more production progress and production time:

First of all, we need to prepare the LED chip(this will be same as SMD LED production); Secondly, we will need to put the LED chip into the LED frame, and then we will need the pure gold wire to connect the cathode and anode of LED frame. There comes different, For SMD LED production, we need to put the epoxy to LED frame and wait until it dry by oven. However, for LED Lamps, we need to inject epoxy into the mold of lens and put all the things to oven for at least 8 hours until they dry. After that, we need to tae them from the oven and get the LED out of mold. And then we need to cut the pins of LED so that they can be easy to test. 

Finally, we got the LED. In order to make sure the quality and the uniform as good as required. We also need to put all the LED to the separation machine and them we will got the LED with same bins. 

through-hole LED progress



Storage Conditions: 

1. avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient temperature;

2. LEDs should be stored with temperature ≤30℃ and relative humidity<60%℃;

3. Product in the original sealed package is recommended to be assembled within 72 hours of opening;

4. Product in opened package for more than a week should be baked for 6-8 hours at 85-10℃;


LED MOUNTING METHOD

1, The lead pitch of the LED must match the pitch of the mounting holes on the PCB during component placement;

Lead-forming may be required to insure the lead pitch matches the hole pitch;

Refer to the figure below for proper lead forming procedures;

Do not route PCB trace in the contact area between the leadframe and the PCB to prevent short-circuits;

1

Noted:

○ Correct mounting method;

× Incorrect mounting method;


2. When soldering wires to the LED, each wire joint should be separately insulated with heat-shrink tube to prevent short-circuit contact.

Do not bundle both wires in one heat shrink tube to avoid pinching the LED leads;

Pinching stress on the led leads may damage the internal structures and cause failure;

2

Noted:

○ Correct mounting method;

× Incorrect mounting method;



3. Use stand-offs(Fig 3)or spacers(Fig 4)to securely position the LED above the PCB;

4. Maintain a minimum of 3mm clearance between the base of the LED lens and the first lead bend (Fig. 5. Fig. 6)

5. During lead forming, use tools or jigs to hold the leads securely so that the bending force will not be transmitted to the LED lens and its internal structures;

Do not perform lead forming once the component has been mounted onto the PCB;

3

Lead Forming Procedures

1. Lead Forming Procedures;

2. Do not bend the leads more than twice (Fig. 7);

3. During soldering, component covers and holders should leave clearance to avoid placing damaging stress on the LED during soldering(Fig 8);

4. The tip of the soldering iron should never touch the lens epoxy;

5. Through-hole LEDs are incompatible with reflow soldering;

6. If the LED will undergo multiple soldering passes or face other processes where the part may be subjected to intense heat please check with Best LED for compatibility;

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