SE8309- factory directly SMT red adhesive
SE8309- factory directly SMT red adhesive
SE8309- factory directly SMT red adhesive

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SE8309- factory directly SMT red adhesive

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Model No. : SE 8309
Brand Name : Seayu

Product description

        Product Description      SE8309 is one component epoxy adhesive and a kind of heat cured adhesive. It designed for stencil printing . High bonding strength, high humidity ,high intensity,excellent electrical performance and good storage stability.   Typical Usage Mainly used for the bonding of the mounted components on SMT.   Properties Uncured  
  Typical Value Range Test Standard
Appearance  Red cream    
Chemical Type  Epoxy Resin    

Viscosity (Pa.s)(Brookfield  RV) Spindle 7

    200-400   GB/T  2794-1995
Thixotropic index  7    
Density (g/cm3)  1.35   1.32-1.38   GB/T  13354-1992

Operate Time at Room Temperature

(day@25°C)
 14    
  Curing Condition Recommended 90-120s at 120°C. 60-90s at 150°C The product will obtain to higher bonding strength when higher curing temperature and longer cured time . the figure curve is the recommended curing temperature and heating rate,Underthe corresponding temperature ,components need the time when they achieve good bonding strength. Users can set the curing furnace’s temperature parameters according to the solidified characteristic curve of the glue and the heat efficiency of the Reflow Ovens     Performance After Cured (Cured for 30min@150°C)   Physical Property                
  Typical Value Test Standard
Hardness(ShoreD)                  88                       GB/T2411-1980
Shear Strength(MPa) 18.5  GB/T7124-1986
Tg(°C)(DSC) 105  ASTM    E1545
Dielectric strength(KV/mm) 26.8 GB/T408.1-1999
Surface resistance (Ω)    3.5×1016                    GB/T1410-2006         
           Direction For Use The product should be recovered to room temperature before use, don't open the aluminum foil package before recovered to room temperature(the recovering time of 300ml packaging at least 2-4 hours). The product should be used at 25°C , The glue viscosity will decline under the higher temperature, which influence printing effect; High humidity can increase the glue of moisture absorption which shorten the opening hours of the glue and influence the glue bonding strength. This product opening time is 48 hours at 25 °C,55% Rh. Suggest to print at the speed of 20-150 mm/s; Drawknife pressure is 3-4 N/cm (Afer scraping, sheet should be clean, and avoid producing wire drawing); the deviating speed from the sheet is 0.1-3.0 mm/s. Not cured adhesive which is stick on line wires can be erased with acetone or propylene alcohol ethers. Please seal and chill when not using up the glue.   Application Process     Notice Keep away from children.  The workshop should be adequate ventilation. Wash with soapy water if on skin. Wash with a lot of soapy water and then go for doctor if in eyes. For more information, please refer to MSDS.             Package NO:6416054 200g NO:6416034 400g   Storage 6 months sealed at 2-8°C. ABOUT US  OUR TRANSPORTATION CONTACT DETAILS   
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