SATA DOM Vertical SSD D6219 for Industrial Application

Specifications *Support Full Disk Encryption with AES128/256-bit strength

*Support dynamic power management and SMART

*TRIM Command supportet

  Product Description  

D6219
Interface	SATA II 3Gbps
Flash Type	MLC
Form Factor	SATA DOM Vertical
Capacity	8GB/16GB/32GB
Max Transfer Performance (Varies by density)	Read: 214 MB/s
	Write: 43 MB/s
Operating Voltage	+5V(±5%)
Power Consumption	0.22(idle)
	0.66(active)
Operating Temperature	0 to 70°C
Storage Temperature	-40 to 85°C
Humidity	5% to 95%
MTBF	2 million hours
Shock	50G,11ms, half-sine wave
Vibration	3.1G(2-500Hz)
Dimension(mm)	50.6*23.4*9.5mm
Weight	≤8.65g
Part No.:
1 Channel
CS1HMS1600-008	8GB
CS1HMS1600-016	16GB
2 Channels
CS2HMS1600-016	16GB
CS2HMS1600-032	32GB

  Company Information   Corporate Overview: Founded as an electronic product manufacturer in Shenzhen, China 1995, BIWIN specializes in producing flash storage products, including solid state drives, Compact Flash cards and USB flash drives. With 18 years' industry expertise and a strong team with over 150 skilled engineers, BIWIN develops its leading edge flash storage products completely in-house, including Solution Designing, Wafer packaging, IC Testing, SMT and Assembling, Product Testing. Manufacturing is conducted according to strict quality standards to ensure consistently high quality products.   BIWIN Vision Statement: BIWIN strives to become a leader in consumer electronic industry in the world. BIWIN's Win-Win Philosophy: BIWIN determines to be customer's best partner by understanding customers’needs and meeting their requirements. While customers enhance their core competitive ability, BIWIN perfects its services and becomes stronger. This is our Win-Win philosophy. Full range of Product Line:  Including 2.5”SATA, 2.5”PATA, SATA DOM, PATA DOM, mSATA, CFast Card, CF Card, eMMC, eMCP, etc. Applicable to harsh operating temperature environments of industrial grade.   Reliability Testing:  -High and Low Temperature Storage -High and Low Temperature Operation
-High and Low Temperature Cycling
-ESD Testing 
-Vibration and Shock Testing
-Room Temperature Aging Testing
-Power Failure Testing     Wafer Packaging Service: -First 12" Wafer Packaging Factory in South China -Include IC Design, Packaging, Testing, Assembling
-Wafer Packaging Products:TSOP 48, QFN, QFP, BGA, LGA, eMMC, UDP.