Resin Bond Blade for electronic chip cutting

Resin Bond  Blade for electronic chip cutting   HT-RB series are sintered diamond blades employ thermo-setting resin as the bond material.Taking advantage of its excellent elasticity,the ability of  this bond to cut has been maximized. They are suitable for processing of hard to cut materials such as glass and crystal materials.   Features: 1.self-sharpness.high cutting ability and efficiency. 2.Excellent bond elasticity,improve cutting quality.   Application:Glass ,Quartz and some hard material.   Specification:   This resin bond cutting blade can fit on Disco and ourself cutting machine.       We trust we will be your ideal partner.