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PCB Production Capability:
Files
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Gerber, Protel, Powerpcb, Autocad, Orcad, etc
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Material
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FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , FR1, CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic)
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Layer No.
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1 - 12 Layers
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Board thickness
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0.0075"(0.2mm)-0.125"(3.2mm)
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Board Thickness Tolerance
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10%
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Copper thickness
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0.5OZ - 4OZ
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Impedance Control
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10%
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Warpage
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0.075%-1.5%
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Peelable
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0.012"(0.3mm)-0.02`(0.5mm)
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Min Trace Width (a)
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0.004"(0.1mm)
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Min Space Width (b)
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0.004"(0.1mm)
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Min Annular Ring
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0.004"(0.1mm)
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SMD Pitch (a)
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0.012"(0.3mm)
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pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b)
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0.027"(0.675mm)
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Regesiter torlerance
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0.05mm
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Min Solder Mask Dam (a)
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0.005"(0.125mm)
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Soldermask Clearance (b)
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0.005"(0.125mm)
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Min SMT Pad spacing (c)
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0.004"(0.1mm)
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Solder Mask Thickness
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0.0007"(0.018mm)
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Hole size
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0.008"(0.20mm)-- 0.257"(6.5mm)
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Hole Size Tol (+/-)
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0.003"(0.0762mm)
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Aspect Ratio
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10:01
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Hole Registration
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0.003"(0.075mm)
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HASL
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2.5um
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Lead free HASL
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2.5um
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Immersion Gold
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Nickel 3-7um Au:1-3u''
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OSP
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0.2-0.5um
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Panel Outline Tol (+/-)
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0.004''(0.1mm)
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Beveling
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3045
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V-cut
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15 30 45 60
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Surface finish
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HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink,
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Certificate
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ROHS ISO9001 TS16949 SGS UL
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Special requirements
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Buried&blind vias, Impedance control, via plug, BGA soldering and gold finger
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