Printed Circuit Boards

Printed Circuit Boards
HFI is a full service PCB (printed circuit board) supplier and offers low volume, quick turn samples right through to medium and high volume production batches. We offer a complete capability to meet almost any requirement from single layer to 36 layer rigid PCB's as well as Flexible Printed Circuits (FPC) up to 18 layers
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Board Types:
· Multilayer rigid PCB's up to 36 layers
· Flexible and flex-rigid circuits up to 18 layers
· Controlled Impedance
· HDI (high density interconnect)
· Hybrid Builds
· Blind and Buried via holes
· RoHS and UL compliant on request

Substrates:
· FR4 Standard epoxy and high temp versions
· Polyimide, Polyester and PET
· PTFE (polytetraflourethylene) and Duriod (glass reinforced PTFE composite)
· Aluminium based materials
· Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels

Board Options:
· CNC routing
· Scoring (V-Grooving)
· Gold on Nickel contact fingers
· LPSM (liquid photoimageable solder mask) range of colors available
· Peelable solder mask
· Screened Conductive Inks (carbon)
· Bare board electrical testing

Board Finishes:
· Immersion Silver
· Immersion Gold
· HASL (hot air solder leveling)
· OSP (organic surface preservative)


ItemManufacture Capability
MaterialFR-4 / Hi Tg FR-4 / FR-5/, 94VO/ 94HB/ Lead free Materials (RoHS Compliant) / CEM-1/CEM-3, Aluminium, Metal based,
Layer No. 1-16
Finished Board thickness0.2 mm-3.8mm'(8 mil-150 mil)

Board Thickness Tolerance± 10%
Cooper thickness0.5 OZ-11OZ (18 um-385 um)
Copper Plating Hole18-40 um
Impedance Control± 10%
Warp&Twist0.70%
Peelable0.012"(0.3mm)-0.02'(0.5mm)
Images
Min Trace Width (a)0.1mm (4 mil)
Min Space Width (b)0.1mm (4 mil)
Min Annular Ring0.1mm (4 mil)
SMD Pitch (a)0.2 mm(8 mil)
BGA Pitch (b)0.2 mm (8 mil)

Solder Mask
Min Solder Mask Dam (a)0.0635 mm (2.5mil)
Soldermask Clearance (b)0.1mm (4 mil)
Min SMT Pad spacing (c)0.1mm (4 mil)
Solder Mask Thickness0.0007"(0.018mm)
Holes
Min Hole size (CNC)0.2 mm (8 mil)
Min Punch Hole Size0.9 mm (35 mil)
Hole Size Tol (+/-)PTH: ± 0.075mm; NPTH: ± 0.05mm
Hole Position Tol± 0.075mm
Plating
HASL2.5um
Lead free HASL2.5um
Immersion GoldNickel 3-7um Au: 1-5u''
OSP0.2-0.5um
Outline
Panel Outline Tol (+/-)CNC: ± 0.125mm, Punching: ± 0.15mm
Beveling30° 45°
Gold Finger angle15° 30° 45° 60°
Certificate RoHS, ISO9001: 2008, SGS, UL certificate