Product description
Materials: FR-4, CEM-1, CEM-3, high TG, FR4 halogen free,Rogers
Thick gold plating PCB with overall thickness: 1.6 to3.2mm
Layer: 1 to 28
Board finished thickness: 0.21 to 7.0mm
Finished board size: 23 x 25 (580 x 900mm) (maximum)
Drilled hole size: 3 mils (0.075mm) (minimum)
Line width: 3 mils (0.075mm) (minimum)
Line spacing: 3 mils (0.075mm) (minimum)
Surface finish/treatment: HASL/HASL lead-free, HAL, chemicaltin, chemical gold, immersion silver, gold, OSP and goldplating
Copper thickness: 0.5 to 7.0oz
Solder mask color: green/yellow/black/white/red/blue
Copper thickness in hole: >25.0um (>1 mil)
Shape tolerance: ±0.13
Hole tolerance:
UL-certified
Special requirements: buried and blind vias + controlledimpedance + BGA
Profiling: punching, routing, V-cut, and beveling
Provides OEM services to all sorts of printed circuit boardassembly as well as electronic encased products
Packing:
- Inner: vacuum packing/plastic bag
- Outer: standard carton packing
PTH: ±0.076
NPTH: ±0.05
Inner: vacuum packing/plastic bag
Outer: standard carton packing