Product description
Product Description
Immersion Gold PCB
Base Materials: FR4
Surface Finishing: Immersion Gold
Solder Mask: Green
Base material: FR4
Layer count: 6-Layer
Copper thickness: 1.0oz (0.5oz/1.5oz/2.0oz/2.5oz/3.0oz)
Board thickness: 1.6mm (0.6mm/0.8mm/1.0mm/1.2mm/2.0mm/2.4mm)
Solder mask: green (yellow/blue/black/red/white/peelable)
Silkscreen: white (black/yellow/blue/red/green)
Surface finishing/treatments: ENIG/immersion gold/(OSP /chemical gold/flash gold/hard gold/ immersion silver/immersion tin/HASL (lead-free))
Minimum line width: 0.075mm (3-mil) (0.003-inch)
Minimum line spacing: 0.075mm (3-mil) (0.003-inch)
Minimum hole size: 0.20mm (8-mil) (0.008-inch)
Features:BGA,Blind/Buried Via,impedance control,Via-in-Pad