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PCB Assembly Service for Car Power Inverters, Made of FR-4, Gold Finger Plating

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PCB Assembly Service for Car Power Inverters, Made of FR-4, Gold Finger Plating

Name: PCB Assembly Service for Car Power Inverters, Made of FR-4, Gold Finger Plating
Brand: Shenzhen Leadsin Technology Co. Ltd
Rating: 4.0 (26 reviews)

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Model No. :	RT6-008-1
Brand Name :

10yrs

Shenzhen, Guangdong, China

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Shenzhen Leadsin Technology Co. Ltd

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PCB Assembly Service for Car Power Inverters, Made of FR-4, Gold Finger Plating

Product description

Features:

Layers: 1 to 22
Product types: rigid PCB, high-density inverter PCB, thick copper PCB
Materials: FR-4, CEM-3, Teflon, aluminum substrate, Rogers, halogen free, high-Tg
Copper thickness: 140 micron (4oz)
Minimum board thickness: 0.4mm
Maximum board thickness: 5.0mm
Minimum finished hole diameter: 0.1mm
Outer layer line width/spacing: 0.1/0.1mm
Inner layer line width/spacing: 0.1/0.1mm
Minimum aperture: 0.2mm
Minimum laser drilling: 0.1mm
Minimum ring width: 0.11mm
Minimum BGA-bit hole spacing: 0.4mm
Resistance tolerance: ±10%
Minimum insulation thickness: 3-mil
Maximum laser blind hole thickness to diameter ratio: 0.8:1
Maximum working board size: 520 x 622mm
Drilling tolerance (PTH): ±0.075mm
Drilling tolerance (NPTH): ±0.05mm
Outline tolerance (CNC): ±0.13mm
Surface coating: lead-free HAL, HAL, flash gold, immersion gold, immersion tin, immersion silver, OSP, gold finger plating, carbon ink printing, peelable blue mask

PCB production capacity:

Double-sided PCB: 200,000ft²/month
Single-sided PCB: 320,000ftsup>2/month
HDI PCB: 80,000ftsup>2/month
Comes with UL, SGS, RoHS marks
Used to a wide range of fields such as computers, digital products, medical equipment, automobiles, communication devices, military, industrial controls and aviation

Layers: 1 to 22

Product types: rigid PCB, high-density inverter PCB, thick copper PCB

Materials: FR-4, CEM-3, Teflon, aluminum substrate, Rogers, halogen free, high-Tg

Copper thickness: 140 micron (4oz)

Minimum board thickness: 0.4mm

Maximum board thickness: 5.0mm

Minimum finished hole diameter: 0.1mm

Outer layer line width/spacing: 0.1/0.1mm

Inner layer line width/spacing: 0.1/0.1mm

Minimum aperture: 0.2mm

Minimum laser drilling: 0.1mm

Minimum ring width: 0.11mm

Minimum BGA-bit hole spacing: 0.4mm

Resistance tolerance: ±10%

Minimum insulation thickness: 3-mil

Maximum laser blind hole thickness to diameter ratio: 0.8:1

Maximum working board size: 520 x 622mm

Drilling tolerance (PTH): ±0.075mm

Drilling tolerance (NPTH): ±0.05mm

Outline tolerance (CNC): ±0.13mm

Surface coating: lead-free HAL, HAL, flash gold, immersion gold, immersion tin, immersion silver, OSP, gold finger plating, carbon ink printing, peelable blue mask

Double-sided PCB: 200,000ft²/month

Single-sided PCB: 320,000ftsup>2/month

HDI PCB: 80,000ftsup>2/month

Comes with UL, SGS, RoHS marks

Used to a wide range of fields such as computers, digital products, medical equipment, automobiles, communication devices, military, industrial controls and aviation