Product description
Reference: our production capability for rigid PCB
Layers: 1 to 28
Board finished thickness: 0.2 to 7.0mm
Material: FR-4, CEM-1, CEM-3, high TG, FR4 halogen free androgers
Finished board size: 23 x 25 (580 x 900mm) (maximum)
Drilled hole size: 3 mil (0.075mm) (minimum)
Line width: 3 mil (0.075mm) (minimum)
Line spacing: 3 mil (0.075mm) (minimum)
Copper thickness: 0.5 to 7.0oz
Solder mask color: green/yellow/black/white/red/blue
Copper thickness in hole: >25.0μm (>1 mil)
Inner packing: vacuum packing/plastic bag
Outer packing: standard carton packing
Shape tolerance: ±0.13
Hole tolerance:
Certificates: UL and SGS
RoHS directive-compliant
Special requirements: buried and blind visa + controlledimpedance + BGA
Profiling: punching, routing, V-cut and beveling
Provides OEM services to all sorts of printed circuit boardassembly as well as electronic encased products
All trademarks shown here are for reference purposesonly. They are the property of their respective owners, and we arenot authorized to sell items bearing such trademarks.
PTH: ±0.076
NPTH: ±0.05