Multilayer PCB with Blind and Buried Vias, 0.2 to 7.0mm Thickness, Used to Motherboard
Multilayer PCB with Blind and Buried Vias, 0.2 to 7.0mm Thickness, Used to Motherboard
Multilayer PCB with Blind and Buried Vias, 0.2 to 7.0mm Thickness, Used to Motherboard

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Multilayer PCB with Blind and Buried Vias, 0.2 to 7.0mm Thickness, Used to Motherboard

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Model No. : wonderful Blind and Buried pcb
Brand Name :
10yrs

Shenzhen, Guangdong, China

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Product description

  • Reference: our production capability for rigid PCB
  • Layers: 1 to 28
  • Board finished thickness: 0.2 to 7.0mm
  • Material: FR-4, CEM-1, CEM-3, high TG, FR4 halogen free androgers
  • Finished board size: 23 x 25 (580 x 900mm) (maximum)
  • Drilled hole size: 3 mil (0.075mm) (minimum)
  • Line width: 3 mil (0.075mm) (minimum)
  • Line spacing: 3 mil (0.075mm) (minimum)
  • Copper thickness: 0.5 to 7.0oz
  • Solder mask color: green/yellow/black/white/red/blue
  • Copper thickness in hole: >25.0μm (>1 mil)
  • Inner packing: vacuum packing/plastic bag
  • Outer packing: standard carton packing
  • Shape tolerance: ±0.13
  • Hole tolerance:
    • PTH: ±0.076
    • NPTH: ±0.05
  • Certificates: UL and SGS
  • RoHS directive-compliant
  • Special requirements: buried and blind visa + controlledimpedance + BGA
  • Profiling: punching, routing, V-cut and beveling
  • Provides OEM services to all sorts of printed circuit boardassembly as well as electronic encased products
  • All trademarks shown here are for reference purposesonly. They are the property of their respective owners, and we arenot authorized to sell items bearing such trademarks.
  • PTH: ±0.076
  • NPTH: ±0.05
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