Product description
Suitable for mobile phone key board
Thickness: 1.6mm
Immersion gold
Rigid PCB
Material: FR-4
Board types:
- Multilayer rigid PCB up to 18 layers
- Flexible and flex-rigid circuits up to 18 layers
- Controlled Impedance
- HDI (high density interconnect)
- Blind and Buried via holes
RoHS and UL compliant certificates on request
Substrates:
- FR4 standard epoxy and high temp versions
- Polyimide, polyester and PET
- PTFE (polytetraflourethylene) and Duriod (glass reinforced PTFE composite)
- Aluminium based materials
- Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
Board options:
- CNC routing
- Scoring (V-grooving)
- Gold on nickel contact fingers
- LPSM (liquid photoimageable solder mask) range of colors available
- Peelable solder mask
- Screened conductive inks (carbon)
- Bare board electrical testing
Board finishes:
- Immersion silver
- Immersion gold
- Lead-free or HASL (hot air solder leveling)
- OSP (organic surface preservative)
- Gold finger
- Plating gold
- Immersion tin
We also offer:
- PCB design
- Circuit layout and drafting
- PCB copy
Multilayer rigid PCB up to 18 layers
Flexible and flex-rigid circuits up to 18 layers
Controlled Impedance
HDI (high density interconnect)
Blind and Buried via holes
FR4 standard epoxy and high temp versions
Polyimide, polyester and PET
PTFE (polytetraflourethylene) and Duriod (glass reinforced PTFE composite)
Aluminium based materials
Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
CNC routing
Scoring (V-grooving)
Gold on nickel contact fingers
LPSM (liquid photoimageable solder mask) range of colors available
Peelable solder mask
Screened conductive inks (carbon)
Bare board electrical testing
Immersion silver
Immersion gold
Lead-free or HASL (hot air solder leveling)
OSP (organic surface preservative)
Gold finger
Plating gold
Immersion tin
PCB design
Circuit layout and drafting
PCB copy