Mobile Phone PCB Board with Immersion Gold Surface Finish
Mobile Phone PCB Board with Immersion Gold Surface Finish
Mobile Phone PCB Board with Immersion Gold Surface Finish

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Mobile Phone PCB Board with Immersion Gold Surface Finish

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Model No. : JXC221
Brand Name :
10yrs

Shenzhen, Guangdong, China

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Product description

  • Suitable for mobile phone key board
  • Thickness: 1.6mm
  • Immersion gold
  • Rigid PCB
  • Material: FR-4
  • Board types:
    • Multilayer rigid PCB up to 18 layers
    • Flexible and flex-rigid circuits up to 18 layers
    • Controlled Impedance
    • HDI (high density interconnect)
    • Blind and Buried via holes
  • RoHS and UL compliant certificates on request
  • Substrates:
    • FR4 standard epoxy and high temp versions
    • Polyimide, polyester and PET
    • PTFE (polytetraflourethylene) and Duriod (glass reinforced PTFE composite)
    • Aluminium based materials
    • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  • Board options:
    • CNC routing
    • Scoring (V-grooving)
    • Gold on nickel contact fingers
    • LPSM (liquid photoimageable solder mask) range of colors available
    • Peelable solder mask
    • Screened conductive inks (carbon)
    • Bare board electrical testing
  • Board finishes:
    • Immersion silver
    • Immersion gold
    • Lead-free or HASL (hot air solder leveling)
    • OSP (organic surface preservative)
    • Gold finger
    • Plating gold
    • Immersion tin
  • We also offer:
    • PCB design
    • Circuit layout and drafting
    • PCB copy
  • Multilayer rigid PCB up to 18 layers
  • Flexible and flex-rigid circuits up to 18 layers
  • Controlled Impedance
  • HDI (high density interconnect)
  • Blind and Buried via holes
  • FR4 standard epoxy and high temp versions
  • Polyimide, polyester and PET
  • PTFE (polytetraflourethylene) and Duriod (glass reinforced PTFE composite)
  • Aluminium based materials
  • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  • CNC routing
  • Scoring (V-grooving)
  • Gold on nickel contact fingers
  • LPSM (liquid photoimageable solder mask) range of colors available
  • Peelable solder mask
  • Screened conductive inks (carbon)
  • Bare board electrical testing
  • Immersion silver
  • Immersion gold
  • Lead-free or HASL (hot air solder leveling)
  • OSP (organic surface preservative)
  • Gold finger
  • Plating gold
  • Immersion tin
  • PCB design
  • Circuit layout and drafting
  • PCB copy
  • Send Inquiry

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