Mini LED

Mini LED backlight generally uses local dimming technology, Through LED densely distributed, it can be implemented in a smaller light range and has better brightness uniformity, so the combination of Mini LED backlight with LCD can be products of ultra-thin, high contrast, high color saturation, Low power consumption and other advantages. The display features are similar to OLED, but the cost is about 60% of OLED.

When the thickness of PCB is less than 0.4mm, when the LED chip is packaged to the PCB substrate, the problem of glue crack will occur due to the difference in thermal expansion coefficient between the packaging adhesive and THE PCB material. Moreover, PCB material has poor thermal conductivity. When the number of LED chips increases, the service life of LED will be reduced. It is a better solution to replace PCB with glass substrate, which is flatter and more stable than PCB except that it does not cause the problems mentioned above.However, MiniLED glass substrate has technical pain points in the future, such as punching of glass, treatment of hole wall, copper covering of hole wall, adhesion between Cu and glass substrate, etc. After a year's research, our company successfully solved these pain points and realized mass production of glass substrate with aperture of 0.01 -- 0.2mm. Through special copper plating process, the adhesion between Cu and glass base plate was improved, so that copper could adhere to the glass base plate perfectly, meeting the requirements of LED welding.