Product description
Technical capabilities:
Layers: 8
Maximum board size: 610 x 610mm
Minimum board thickness:
2 layers: 8-mil (0.2mm)
4 layers: 16-mil (0.4mm)
6 layers: 24-mil (0.6mm)
8 layers: 32-mil (0.8mm)
10 layers: 40-mil (1.0mm)
Maximum board thickness: 280-mil (7mm)
Minimum line width: 3-mil (0.075mm)
Minimum line space: 3-mil (0.075mm)
Minimum hole size: 6-mil (0.15mm)
PTH diameter tolerance: ±2-mil (0.05mm)
NPTH hole diameter tolerance: ±1 mil (0.025mm)
Hole position deviation: ±2-mil (0.05mm)
Outline tolerance: ±4-mil (0.1mm)
S/M pitch: 3-mil (0.075mm)
Aspect ratio: 1:12
Finishing copper thickness: 7oz
Profiling: punching, routing, V-cut, beveling
Impedance control: ±5%
Insulation resistance: 1E + 12© (normal)
Thermal shock: 3 x 288 seconds
Warp and twist: ≤0.7%
Electric strength: >1.3kV/mm
Peel strength: 1.4N/mm
Solder mask color: green/yellow/black/white/red/blue
Solder mask abrasion: ≥6 hours
Flammability: 94V-0
Surface finishing: HASL, LF-HASL, ENIG, flash gold, immersiontin, immersion silver, OSP, gold finger, peelable mask, carbonprinting and selective surface processing
Materials: FR-4, Rogers, Taconic, ARLON, BT, ceramic andaluminum
Packing:
Inner: vacuum/plastic
Outer: standard carton
Certificates: UL-351742, SGS.DQS
Minimum order quantity: 20sqm
Delivery lead-time: 15 days
Sample available: yes
Loading information: depend on customer
Packing information: standard carton with min cardboard on sixsides to protect the goods
