Product description
Features:
- Machine selects infrared highly effective component to give off heat which independent exploration
- Adopts advanced PID intelligent controlling warm heating technology and controls warm precisely
- Can achieve to heat PCB board and component which contains lead or not, especially suit to BGA and SMD
- Uses infrared heat, easy to cut through, heat proportion, don't have sirocco flow, don't shift small component on PCB board and ensure welding
- Machine has 600W heating system, widely to 120 x 120mm
- Can be used with handheld infrared welder T-835
- Easy to operate, can operate it through easy training
Specifications:
- Work floor size: 200 x 240mm
- Rated voltage and frequency: 110 or 220 to 230V AC, 60/50Hz
- Complete machine power: 800W
- Preheating chassis power: 600W
- Preheating chassis size: 120 x 120mm
- Adjustable preheating chassis temperatures: 0 to 450°C
Main components:
- Preheating oven main body: 1
- Temperature sensor: 1
- Board support of the circuit: 1
- Power line: 1
- User's manual: 1 (compact disc)
Machine selects infrared highly effective component to give off heat which independent exploration
Adopts advanced PID intelligent controlling warm heating technology and controls warm precisely
Can achieve to heat PCB board and component which contains lead or not, especially suit to BGA and SMD
Uses infrared heat, easy to cut through, heat proportion, don't have sirocco flow, don't shift small component on PCB board and ensure welding
Machine has 600W heating system, widely to 120 x 120mm
Can be used with handheld infrared welder T-835
Easy to operate, can operate it through easy training
Work floor size: 200 x 240mm
Rated voltage and frequency: 110 or 220 to 230V AC, 60/50Hz
Complete machine power: 800W
Preheating chassis power: 600W
Preheating chassis size: 120 x 120mm
Adjustable preheating chassis temperatures: 0 to 450°C
Preheating oven main body: 1
Temperature sensor: 1
Board support of the circuit: 1
Power line: 1
User's manual: 1 (compact disc)