Inverter Hasl Finished Custom Pcb Assembly Green
Inverter Hasl Finished Custom Pcb Assembly Green
Inverter Hasl Finished Custom Pcb Assembly Green
Inverter Hasl Finished Custom Pcb Assembly Green
Inverter Hasl Finished Custom Pcb Assembly Green
Inverter Hasl Finished Custom Pcb Assembly Green

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Inverter Hasl Finished Custom Pcb Assembly Green

  • $0.80

    ≥1 Piece/Pieces

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  • pcs
  • PCB/PCBA mobile
  • PCBA LED
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Model No. : Through-Hole Assembly
Brand Name :
place of origin : China
Number of layers : 4-Layer,6-Layer,8-Layer,10-Layer,12-Layer
Min SMT Package : 0.201
Min IC pitch : 0.4mm
Max BGA size : 70*70mm
BGA ball pitch : 1.00 To 3.00mm
BGA ball diameter : 0.4 To 1.0mm
Testing Service: : Aoi X-Ray Function Test
Certificate: : Iso9001/Iatf16949/Iso13485
QFP lead pitch : 0.4 To 2.5mm
Surface Finishing: : Hal,Enig,Immersion Tin/Sliver
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3yrs

Shenzhen, Guangdong, China

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Product description

What are the components of PCBA?

PCBA aims to provide a central hub for integrating all the electronic components in the device. Using multiple layers to create a board, conductive paths or lines can be laminated to the substrate material. These copper traces are used to conduct electricity and serve as a circuit for all components soldered to the board, thereby supplying power to the device, while providing insulation and safe current transmission. Each PCB hardware component plays a vital role in powering electronic devices The role of. PCB components include

Electronic connectors,Cable Connectors I/O Connectors,originality electronics  IC ,Electronic Resistor and Capacitor.
In the PCBA manufacturing process, especially in testing, the ever-increasing complexity and density of PCBA is not a new issue. Realizing that increasing the number of test pins in the ICT test fixture is not the way to go, we began to observe alternative circuit verification methods. Seeing the number of non-contact probes per million, we found that at 5000 nodes, many of the errors found (less than 31) may be due to probe contact problems rather than actual manufacturing defects (Table 1). Therefore, we set out to reduce the number of test pins, rather than increase them. Nevertheless, the quality of our manufacturing process is evaluated to the entire PCBA. We decided that the combination of traditional ICT and X-ray layering is a feasible solution.Hdi Printed Circuit Board JpgFr4 Tg180 Hdi Printed Circuit Board JpgCircuit Board Pcb Fabrication And Assembly JpgCircuit Board Pcb Fabrication Jpg

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