Industrial Ceramic Substrates

 THE LEADING MANUFACTURER FOR ELECTRONIC CERAMIC CIRCUIT SUBSTRATE!
The plate is mainly used in high-density hybrid circuits,microwave power devices,power semiconductor devices,power electronic devices,optoelectronic components,semiconductor refrigeration products such as substrates for high-performance materials and packaging materials.Characteristics:high thermal conductivity,good electrical properties,thermal expansion coefficient with Si-chip approach,non-toxic,is intended to replace the ideal material for ceramic BeO.
Normal Specifications: 

property content	property index
Density(g/cm3)	≥3.30 g/cm3
Water absorption (%)	0
Thermal conductivity(20°C, W/m.k)	≥170
Linear expansion coefficient (RT-400°C,10-6/°C)	4.4
Flexural strength (MPa)	≥330
Bulk resistance (Ω.cm)	≥1014
Dielectric constant(1MHz)	9.0
Dissipation factor (1MHz)	3×10-4
Dielectric strength (KV/mm)	≥15
Surface roughness Ra(μm)	0.3~0.5 (≤20nm)
Camber (~/25.4(length))	0.03~0.05
Appearance	Dense

Other specifications are available to produce as customers’requirements,and Copper/Nickel/Gold/Silver etc.metallization processing!