Product description
Features:
- Provides ultra-low conduction loss as well as short-circuit ruggedness
- Designed for applications such as SMPS and UPS
- Soft punch through (SPT+) technology
- Fast soft inverse CAL diodes
- 10μs short-circuit capability
- Positive VCE (on) temperature co-efficient
- Inside IGBT chips is import from Infineon
- Packing machines from OE, same technology with Semikron and Infineon
Applications:
- High power inverter
- Switched mode power supplies (SMPS)
- UPS
- Electrical welding machine
- DC servo and robot drives
Industry standard packing
Provides ultra-low conduction loss as well as short-circuit ruggedness
Designed for applications such as SMPS and UPS
Soft punch through (SPT+) technology
Fast soft inverse CAL diodes
10μs short-circuit capability
Positive VCE (on) temperature co-efficient
Inside IGBT chips is import from Infineon
Packing machines from OE, same technology with Semikron and Infineon
High power inverter
Switched mode power supplies (SMPS)
UPS
Electrical welding machine
DC servo and robot drives