Hot sale multilayer, FR4 customer PCB fabrication
Hot sale multilayer, FR4 customer PCB fabrication
Hot sale multilayer, FR4 customer PCB fabrication

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Hot sale multilayer, FR4 customer PCB fabrication

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Model No. : JXC144
Brand Name :
10yrs

Shenzhen, Guangdong, China

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Product description

  • Hot sale multilayer  FR4 customer PCB (printed circuit board ) fabrication
  • Minimum line width: ≥0.08mm
  • Minimum line spacing: ≥0.08mm
  • Thickness: 2.0
  • Hole diameter: ≥0.2mm
  • Black solder mask
  • Surface technology: lead-free HASL, immersion gold
  • Board types:
    • Multilayer rigid PCB's up to 18 layers
    • Flexible and flex-rigid circuits up to 18 layers
    • Controlled impedance
    • HDI (high density interconnect)
    • Blind and buried via holes
    • RoHS and UL compliant on request
  • Substrates:
    • FR4 standard epoxy and high temp versions
    • Polyimide, polyester and PET
      PTFE (polytetrafluoethylene) and duroid (glass reinforced PTFE composite)
    • Aluminum based materials
    • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  • Board options:
    • CNC routing
    • Scoring (V-grooving)
    • Gold on nickel contact fingers
    • LPSM (liquid photo image-able solder mask)
    • Range of colors available
    • Peel-able solder mask
    • Screened conductive inks (carbon)
    • Bare board electrical testing
  • Board finishes:
    • Immersion silver
    • Immersion gold
    • Lead-free or HASL (hot air solder leveling)
    • OSP (organic surface preservative)
    • Gold finger
    • Plating gold
    • Immersion tin
  • Multilayer rigid PCB's up to 18 layers
  • Flexible and flex-rigid circuits up to 18 layers
  • Controlled impedance
  • HDI (high density interconnect)
  • Blind and buried via holes
  • RoHS and UL compliant on request
  • FR4 standard epoxy and high temp versions
  • Polyimide, polyester and PET
    PTFE (polytetrafluoethylene) and duroid (glass reinforced PTFE composite)
  • Aluminum based materials
  • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  • CNC routing
  • Scoring (V-grooving)
  • Gold on nickel contact fingers
  • LPSM (liquid photo image-able solder mask)
  • Range of colors available
  • Peel-able solder mask
  • Screened conductive inks (carbon)
  • Bare board electrical testing
  • Immersion silver
  • Immersion gold
  • Lead-free or HASL (hot air solder leveling)
  • OSP (organic surface preservative)
  • Gold finger
  • Plating gold
  • Immersion tin
  • Send Inquiry

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