Product description
Hot sale multilayer FR4 customer PCB (printed circuit board ) fabrication
Minimum line width: ≥0.08mm
Minimum line spacing: ≥0.08mm
Thickness: 2.0
Hole diameter: ≥0.2mm
Black solder mask
Surface technology: lead-free HASL, immersion gold
Board types:
- Multilayer rigid PCB's up to 18 layers
- Flexible and flex-rigid circuits up to 18 layers
- Controlled impedance
- HDI (high density interconnect)
- Blind and buried via holes
- RoHS and UL compliant on request
Substrates:
- FR4 standard epoxy and high temp versions
- Polyimide, polyester and PET
PTFE (polytetrafluoethylene) and duroid (glass reinforced PTFE composite)
- Aluminum based materials
- Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
Board options:
- CNC routing
- Scoring (V-grooving)
- Gold on nickel contact fingers
- LPSM (liquid photo image-able solder mask)
- Range of colors available
- Peel-able solder mask
- Screened conductive inks (carbon)
- Bare board electrical testing
Board finishes:
- Immersion silver
- Immersion gold
- Lead-free or HASL (hot air solder leveling)
- OSP (organic surface preservative)
- Gold finger
- Plating gold
- Immersion tin
Multilayer rigid PCB's up to 18 layers
Flexible and flex-rigid circuits up to 18 layers
Controlled impedance
HDI (high density interconnect)
Blind and buried via holes
RoHS and UL compliant on request
FR4 standard epoxy and high temp versions
Polyimide, polyester and PET
PTFE (polytetrafluoethylene) and duroid (glass reinforced PTFE composite)
Aluminum based materials
Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
CNC routing
Scoring (V-grooving)
Gold on nickel contact fingers
LPSM (liquid photo image-able solder mask)
Range of colors available
Peel-able solder mask
Screened conductive inks (carbon)
Bare board electrical testing
Immersion silver
Immersion gold
Lead-free or HASL (hot air solder leveling)
OSP (organic surface preservative)
Gold finger
Plating gold
Immersion tin