High temperature resistance one part epoxy glue adhesive resin for electronic devices

Specifications   Encapsulating adhesive of epoxy resin for COB 
One part, no volatile content epoxy resin. 

  High temperature resistance one part epoxy glue adhesive resin for electronic devices   EP-A is one part, no volatile content epoxy resin.  It exhibits several outstanding properties as follows: 1. Single component, easy to use. 2. Could be cured at low temperature compare with ordinary one component epoxy adhesive. 3. Excellent heat distortion temperature. 4. Compatible with most metal, plastic material adhesion. 5. Good electrical and chemical properties. 6. Cold storage temperature: 2-10 degree C.   Properties: Appearance: Black paste Viscosity (25 degree C,cps): 40000-50000 Hardness (25 degree C): Shore D 90 Cure condition: 80 degree C x 30 minutes or 120 degree C x 20 minutes Linear strength (in/in): 0.015 Tensile strength (psi): 2,650 Compressive strength (psi): 12,780 Thermal Conductivity (cal/sec/cm2/degree C/cm x 10-4: 6.8 Heat distortion temperature: 130 degree C Volume resistivity (ohm-cm): 8 x 10(15) Dielectric strength (v/mil): 450 Dielectric constant: 4.0