HASL FR4 PCB Board Hard Gold PCB Assembly with RoHS Certifi

HASL FR4 PCB Board Hard Gold PCB Assembly with RoHS Certificate

Quick Detail:

1. Layer: 1-30 layer
2. Material:CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
3. Board thickness:0.2mm-6mm
4. min.line width:0.075mm(3mil)
5. min.line spacing:0.075mm(3mil)
6. Surface finish:HAL, HAL Lead free,Immersion Gold/ Silver/Tin,Hard Gold, OSP
7. PCB/PCB Assembly manufacturing :OEM/ODM service
8. UL,ROHS,CE,SGS

Detailed Specification of PCB Manufacturing

1	layer	1-30 layer
2	Material	CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
3	Board thickness	0.2mm-6mm
4	Max.finished board size	800*508mm
5	Min.drilled hole size	0.25mm
6	min.line width	0.075mm(3mil)
7	min.line spacing	0.075mm(3mil)
8	Surface finish	HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP
9	Copper thickness	0.5-4.0oz
10	Solder mask color	green/black/white/red/blue/yellow
11	Inner packing	Vacuum packing,Plastic bag
12	Outer packing	standard carton packing
13	Hole tolerance	PTH:±0.076,NTPH:±0.05
14	Certificate	UL,ISO9001,ISO14001,ROHS,TS16949
15	Profiling punching	Routing,V-CUT,Beveling

Detailed Specification of Pcb Assembly

1	Type of Assembly	SMT and Thru-hole
2	Solder Type	Water Soluble Solder Paste,Leaded and Lead-Free
3	Components	Passives Down to 0201 Size
		BGA and VFBGA
		Leadless Chip Carries/CSP
		Double-Sided SMT Assembly
		Fine Pitch to 08 Mils
		BGA Repair and Reball
		Part Removal and Replacement-Same Day Service
3	Bare Board Size	Smallest:0.25x0.25 Inches
		Largest:20x20 Inches
4	File Formats	Bill of Materials
		Gerber Files
		Pick-N-Place File(XYRS)
5	Type of Service	Turn-Key,Partial Turn-Key or Consignment
6	Component Packaging	Cut Tape
		Tube
		Reels
		Loose Parts
7	Turn Time	15 to 20 days
8	Testing	AOI inspection
		X-Ray inspection
		In-Circuit testing
		Functional test

PCB capability and services:

1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)

2. Flexible PCB (up to 10 layers)

3. Rigid-flex PCB (up to 8 layers)

4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test

PCB Assembly services:

SMT Assembly
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection

Through-hole Assembly

Wave Soldering
Hand Assembly and Soldering

Material Sourcing
IC pre-programming / Burning on-line

Function testing as requested

Aging test for LED and Power boards

Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design

Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is

applied onto the printed circuit board assembly to protect the electronic assembly from damage due to

contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.

When coated, it is clearly visible as a clear and shiny material.

Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,

plastics, casings and print & packaging material

Testing Methods

AOI Testing
·Checks for solder paste
·Checks for components down to 0201"
·Checks for missing components, offset, incorrect parts, polarity

X-Ray Inspection
X-Ray provides high-resolution inspection of:
·BGAs
·Bare boards

In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by

component problems.
· Power-up Test
· Advanced Function Test
· Flash Device Programming
· Functional testing

ISO Certification:
Huaswin’s production facility is ISO9001 certified to ensure top quality production of your product!