epoxy adhesive encapsulate with long pot life

Specifications 1) Free halogen epoxy adhesive encapsulate

2) Fast cure, reworkable, two color choice

3) long pot life, adjustable viscosity

epoxy adhesive encapsulate with long pot life   INTRODUCTION                                                                  HQ-124 is a one component, halogen free, epoxy adhesive designed for use as a reworkable underfill resin for CSP(FBGA) or BGA. It cures rapidly on exposure to heat. It is designed to give excellent protection from failure due to mechanical stress. The low viscosity allows filling in gaps under CSP or BGA.  

Chemical Type	Epoxy
Appearance	yellow liquid / Black liquid
Cure	Heat cure
Cure Benefit	Production - high speed curing
Application	Underfill
Specific Application	Reworkable underfill for CSP (FBGA) or BGA
Dispense Method	Syringe
Key Substrates	SMD components to PCB

  MAIN FEATURES                                                                1)      Halogen free 2)      Long pot life 3)      Two color choice 4)      Fast cure, reworkable 5)      Low CTE, high reliability 6)      Adjustable viscosity, excellent storability   UNCURED PROPERTIES                                                           

APS   HQ-124Y / HQ-124B
Appearance	HQ-124Y: yellow liquid                                    HQ-124B: Black liquid
Viscosity at 25°C / mPa	Adjustable viscosity: 600-2500
Density at 25°C / g/cm³	1.1-1.2
Cure condition	120°C*10min or 150°C*5min
Pot life at 25°C / days	30
shelf life at 0-5°C / months	6
Package	10mL, 30mL, 55mL tube

  CURED PROPERTIES                                                             

APS   HQ-124Y / HQ-124B
Hardness (Shore D)	80
Density at 25°C (g/cm³)	1.13-1.23
Shrinkage (%)	2.5
Tg by TMA (°C)	50
Water absorption 25°C*24h (%)	0.2
Elongation at break (%)	3.6
Tensile strength (N/mm2)	20
Volume resistivity (ohm·cm)	4.6×1016
Surface resistivity (ohm)	1.4×1016