Product description
Surface finish: gold-plated, immersion gold, lead-free HASL
Layers: 2 to 16
Blind and buried via rigid and flex PCB
High TG and frequency
Board thickness: 0.6 to 3mm
Minimum hole diameter: 0.35mm
Minimum line width and space: 0.1mm
Twist and warp: less than 1%
Placement precision: 0.1mm on integrated circuit parts with SO, SOP, SOJ, TSSOP, QFP and BGA
SMT for 0201, 0402, 0603, 0805, 1008, 1206 and 1210
Dip pitches through hole down to 0.60mm
Solder components to underside of board without disrupting topside
Inspection in for QOI and ICT testing in line
X-ray inspection for BGA
Maximum panel size: 550 x 660mm
RoHS Directive-compliant