Product description
Layer: 1 to 22 layers electronic board manufacture
Product types: rigid PCB, high-density inverter PCB, thick copper PCB
Materials: FR-4, CEM-3, Teflon, aluminum substrate, Rogers, halogen free, high-Tg
Copper thickness: 140 micron (4oz)
Minimum board thickness: 0.4mm
Maximum board thickness: 5.0mm
Minimum finished hole diameter: 0.1mm
Outer layer line width/spacing: 0.1/0.1mm
Inner layer line width/spacing: 0.1/0.1mm
Minimum aperture: 0.2mm
Minimum laser drilling: 0.1mm
Minimum ring width: 0.11mm
Minimum BGA-bit hole spacing: 0.4mm
Resistance tolerance: ±10%
Minimum insulation thickness: 3-mil
Maximum laser blind hole thickness to diameter ratio: 0.8:1
Maximum working board size: 520 x 622mm
Drilling tolerance (PTH): ±0.075mm
Drilling tolerance (NPTH): ±0.05mm
Outline tolerance (CNC): ±0.13mm
Surface coating: lead-free HAL, HAL, flash gold, immersion gold, immersion tin, immersion silver, OSP, gold finger plating, carbon ink printing, peelable blue mask
PCB production capacity:
- Double-sided PCB: 200,000ft2/month
- Single-sided PCB: 320,000ft2/month
- HDI PCB: 80,000ft2/month
Comes with UL, SGS, RoHS marks
Used to a wide range of fields such as computers, digital products, medical equipment, automobiles, communication devices, military, industrial controls and aviation
Double-sided PCB: 200,000ft2/month
Single-sided PCB: 320,000ft2/month
HDI PCB: 80,000ft2/month