Electroformed hub dicing blade

Eelectroformed hub dicing blade is used for cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap), Oxide Wafers (LiTaO3), Optical Glass.

Details

Electroformed hub dicing blade is made by using an ultra-thin diamond wheel and a high precision aluminum alloy hub.

Applications Of Hub Dicing Blade

Cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap), Oxide Wafers (LiTaO3), Optical Glass

The Features Of Hub Type Dicing Blade

* Improving balance between blade life and processing quality (in particular backside chipping)

* Strengthens rigidity, Reduction in wavy cutting and blade wear under high load conditions

* Precise control of diamond grit size, diamond concentration, and nickel bond hardness to reduce splitting on the edges

* Realizes high speed wafer cutting after laser grooving

The Specifications Of Hub Type Dicing Blade

Exposure(μm)	380	510	640	760	890	1020	1150	1270	Grit Size
Kerf width(μm)	380-510	510-640	640-760	760-890	890-1020	1020-1150	1150-1270	1270-1400	#5000 #4800 #4500 #4000 #3500 #3000 #2500 #2000 #1800 #1700 #1500
16-20	20*380	20*510
21-25	25*380	25*510	25*640
26-30	30*380	30*510	30*640	30*760	30*890	20*1020
31-35	35*380	35*510	35*640	35*760	35*890	35*1020
36-40	40*380	40*510	40*640	40*760	40*890	40*1020	40*1150
41-50	50*380	50*510	50*640	50*760	50*890	50*1020	50*1150
51-60		60*510	60*640	60*760	60*890	60*1020	60*1150	60*1270
61-70			70*640	70*760	70*890	70*1020	70*1150	70*1270
71-80					80*890	80*1020	80*1150	80*1270
81-90						90*1020	90*1150	90*1270