Product description
Layers: 2
Board materials: FR4, Tg130
Board thickness: 0.062-inch
Surface finish: immersion gold
Copper thickness:
- Outer layer: 1oz
- Inner layer: 0.5oz
Solder mask: green
Minimum trace width/gap: 0.15mm (minimum)
Aperture: 0.3mm (minimum)
Peel strength: 1.25
Solder blister resistance: ≥60 (288°C)
Flammability: UL94 V0
Outline tolerance:
- CNC: 0.125mm
- Punching: 0.15mm
Warp and twist: 0.70%
Minimum solder mask bridge: 0.0635mm
Minimum distance between line to board bridge:
- Outline: 0.25mm
- V-cut: 0.40mm
Impedance control tolerance: ±10%
Test voltages: 10 to 300V
Outer layer: 1oz
Inner layer: 0.5oz
CNC: 0.125mm
Punching: 0.15mm
Outline: 0.25mm
V-cut: 0.40mm