Product description
Capability:
- Layer: 1 to 28
- Board finished thickness: 0.21 to 7.0mm
- Material: FR-4, CEM-1, CEM-3, High TG, FR4 halogen free and Rogers
- Maximum finished board size: 23 x 25mm (580 x 900mm)
- Minimum drilled hole size: 3-mil (0.075mm)
- Minimum line width: 3-mil (0.075mm)
- Minimum line spacing: 3-mil (0.075mm)
- Surface finishing/treatment: HASL/HASL lead-free, HAL, chemical tin, chemical gold, immersion silver/gold, OSP and gold-plating
- Copper thickness: 0.5 to 7.0oz
- Solder mask color: green/yellow/black/white/red/blue
- Copper thickness in hole: >25.0μm (>1 mil)
- Inner packing: vacuum packing/plastic bag
- Outer packing: standard carton packing
- Shape tolerance: ±0.13
- Hole tolerance:
- UL pending
- Special requirements: buried and blind vias, controlled impedance and BGA
- Profiling: punching, routing, V-cut and beveling
Layer: 1 to 28
Board finished thickness: 0.21 to 7.0mm
Material: FR-4, CEM-1, CEM-3, High TG, FR4 halogen free and Rogers
Maximum finished board size: 23 x 25mm (580 x 900mm)
Minimum drilled hole size: 3-mil (0.075mm)
Minimum line width: 3-mil (0.075mm)
Minimum line spacing: 3-mil (0.075mm)
Surface finishing/treatment: HASL/HASL lead-free, HAL, chemical tin, chemical gold, immersion silver/gold, OSP and gold-plating
Copper thickness: 0.5 to 7.0oz
Solder mask color: green/yellow/black/white/red/blue
Copper thickness in hole: >25.0μm (>1 mil)
Inner packing: vacuum packing/plastic bag
Outer packing: standard carton packing
Shape tolerance: ±0.13
Hole tolerance:
UL pending
Special requirements: buried and blind vias, controlled impedance and BGA
Profiling: punching, routing, V-cut and beveling
PTH: ±0.076
NPTH: ±0.05