Product description
Specifications:
- Memory capacity: 1/2/4GB
- DDR memory type: DDR2
- Number of pins: 200-pin SO-DIMM
- Module type: SO-DIMM
- Function: non-ECC memory
- VDD: 1.8V power supply
- Frequency: 533/667/800MHz
- Bandwidth: 5,300/6,400
- Latency: 2.5-3-3-7
- Data mask (DM) for write data
- Capacity: 256/512MB/1/2/4GB
- Chip: Hynix, Elp, Micron, Samsung and Infineon
- Packing: BGA/TSOP
Memory capacity: 1/2/4GB
DDR memory type: DDR2
Number of pins: 200-pin SO-DIMM
Module type: SO-DIMM
Function: non-ECC memory
VDD: 1.8V power supply
Frequency: 533/667/800MHz
Bandwidth: 5,300/6,400
Latency: 2.5-3-3-7
Data mask (DM) for write data
Capacity: 256/512MB/1/2/4GB
Chip: Hynix, Elp, Micron, Samsung and Infineon
Packing: BGA/TSOP