Cu welding wire

Specifications Usage: IC/ Discrete device/Power device packaging

Excellent stability and oxidation resistance

High reliability and short HAZ

  Our Cu welding wire made of Single Crystal copper may match various IC /power device/discrete device package. Its performance has been confirmed by the professional team in  wire bonding application in China and other countries in volume production, The bonding wire cost can reduce to 50% of the gold bonding wire.   Excellent performance of our bonding wires : With the leading micro-alloy technology,we can ensure it has excellent stability and oxidation resistance in the process of copper ball in copper wire bonding.
Our product have a short HAZ which can ensure good radians.
We have perfect integrated management to ensure our copper wires have excellent stability batches.   By adding trace elements to increase the stability of wires and shear and tension of solder joints.
Good stability of wires can improve the production efficiency.   Spec.of bonding wire:   

Dia. mm	Dia. Mil	Tensile strength (gm)	Elongation (%)	Conductor IACS	Spool Color
0.015	0.6	4-6	5-10	101.0	Red
0.018	0.7	6-10	6-12	101.0	Red
0.020	0.8	7-11	8-14	101.0	Blue
0.023	0.9	8-14	10-16	101.1	Yellow
0.025	1.0	9-15	10-16	101.1	Black
0.030	1.2	12-22	12-20	101.2	Write
0.032	1.3	14-24	12-20	101.2	Blue
0.038	1.5	18-30	12-20	101.5	Green
0.042	1.7	30-40	12-22	101.5	Purple
0.050	2.0	40-55	15-25	101.5	Brown