Crystal Wire Cutting Machine (YJXQL1210A)

Applications:
This saw is designed for cutting hard and fragile materials such as, diamond, crystal, amonocrystalline silicon, and magnetic material and etc.



Main features:
1, Max work size: 250mm × 300mm × 150mm, TTV: ± 0.01mm
2, Max wire speed: 600m/min
3, Advanced YASKAWA servo system enables a stable system performance.
4, Both steel wire and diamond wire is usable.
5, Supply and collection side equipped with winding traversal servo motor. Two-way wire supply is realized.
6, Worktable can rotate and move from forward to backword.
7, With great appearance, fine film and it hardly drops or fades.
8, Cutting area, wire supply and collection area are sealed by technique mothod. This ensures no oil and abrasive leakage.
9, Cutting area, wire supply and collection area is separated. This patented technology extends the service life of pulleys.
10, Vertical structure of tensioning system, wire supply and collection system reduces pulley quantity.
Equipped with 12 PCS of big pulley.
Supply and collection side equipped with winding traversal servo motor.
Tension controlled by servo motor. Tension precision belows± 0.5N.