china electronic pcb manufacture

Product Description 1.PCB Board Processing Capability:

1	Layers	Single Sided, 2 to 36 Layer
2	Board material type	FR4
3	Compound material lamination	4 to 6 layers
4	Copper Thickness:	1oz
5	Board Thickness:	1.6mm
6	Min. Hole Diameter:	0.15mm
7	Min. Line Width:	0.1mm
8	Min. Line Spacing:	0.1mm
9	Surface Finishing:	HASL lead free
10	Solder mask:	Green
11	Outer layer copper thickness	8.75 to 175µm
12	Inner layer copper thickness	17.5 to 175µm
13	Drilling hole diameter (mechanical drill)	0.25 to 6.00mm
14	Finished hole diameter (mechanical drill)	0.20 to 6.00mm
15	Hole diameter tolerance (mechanical drill)	0.05mm
16	Hole position tolerance (mechanical drill)	0.075mm
17	Laser drill hole size	0.10mm
18	Board thickness and hole diameter ratio	10:1
19	Solder mask type	Green, Yellow, Black, Purple, Blue, White and Red
20	Minimum solder mask	Ø0.10mm
21	Minimum size of solder mask separation ring	0.05mm
22	Solder mask oil plug hole diameter	0.25 to 0.60mm
23	Impedance control tolerance	±10%
24	Surface finish	Hot air level, ENIG, immersion silver, gold plating, immersion tin and gold finger

Product Descriptions ♦ All of the above description is to demonstrate the ability of our factory, if you have specific requirements, please contact us. 2.Detailed Terms for PCB Assembly:

Technical Requirement	Professional Surface-mounting and Through-hole soldering Technology
	Various sizes like 1206, 0805, 0603 components SMT technology
	ICT(In Circuit Test), FCT(Functional Circuit Test) technology
	PCB Assembly With UL, CE, FCC, Rohs Approval
	Nitrogen gas reflow soldering technology for SMT
	High Standard SMT&Solder Assembly Line
	High density interconnected board placement technology capacity
Quote&Production Requirement	Gerber File or PCB File for Bare PCB Board Fabrication
	BOM(Bill of Material) for Assembly, PNP(Pick and Place file) and Components Position also needed in assembly
	To reduce the quote time, please provide us the full part number for each components, Quantity per board also the quantity for orders.
	Testing Guide&Function Testing method to ensure the quality to reach nearly 0% scrap rate
OEM/ODM/EMS Services	PCBA, PCB assembly: SMT & PTH & BGA
	PCBA and enclosure design
	Components sourcing and purchasing
	Quick prototyping
	Plastic injection molding
	Metal sheet stamping
	Final assembly
	Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
	Custom clearance for material importing and product exporting
Other  PCB Assembly Equipments	SMT Machine: SIEMENS SIPLACE D1/D2 / SIEMENS SIPLACE S20/F4
	Reflow Oven: FolunGwin FL-RX860
	Wave Soldering Machine: FolunGwin ADS300
	Automated Optical Inspection (AOI): Aleader ALD-H-350B,X-RAY Testing Service
	Fully Automatic SMT Stencil Printer: FolunGwin Win-5

PCBA Produc Line:   Technical characteri Dielectiric strength:2.5kv dc-2seconds Conductor resistance:Max 9.38ohm/100m at 20°C Max ring resistance:16.8ohm/100m at 20°C Max mutual capacitance:530pf/100m Max capacity unbalance:110pf/100m Impedance:100±15%ohm at 1-250MHZ resistance:16.8 ohm/100m at 20°C Operating tempetature: -20°C~+70°C Packaging & Shipping