Ceramic Curcuit Base with Metallization
Ceramic Curcuit Base with Metallization
Ceramic Curcuit Base with Metallization

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Ceramic Curcuit Base with Metallization

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Model No. : Ceramic Base
Brand Name : Xinxing

Product description

Ceramic Curcuit Base with Metallization   Detailed Product Description   1.0.5mm Thickness Alumina PCB Substrate
2.Alumina content:96%,99%,99.8%
3.High Temperature Resistance(1800C) 
  Features:   1.Chemically inert, anti-acid, anti-alkaline
2.Superior reliability and durability
3.Excellent resistance to heat. Maintain the mechanical strength in high temperature circumstances
4.The Alumina PCB substrate can be made according to the customers' requirements.     Regular thickness:   0.25mm, 0.28mm, 0.45mm, 0.5mm, 0.635mm, 1.0mm, 1.5mm, 1.8mm, 2.0mm     Metallization:         The surface can be covered a lay of metallization,such as Ag, Pd-Ag,Mo-Mn, Ni-plating with good tensile strength: Mo-Mn thickness: 25~40μm,Ni thickness:3~7μm, Tensile strength≥120MPa
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