Automotive Battery Charger Circuit Board Assembly with Copp

Key Specifications/Special Features

1

We SYF have 6 PCB production lines and 4 advanced SMT lines with high speed.

2

All kinds of integrated circuits are accepted,such as SO, SOP, SOJ, TSOP, TSSOP, QFP, DIP, CSP,BGA and U-BGA , Because Our placement precision can reach chip +0.1mm on integrated circuit parts.

3

We SYF can provide service of 0201 chip placement, through-hole components insertion and finished products fabrication, testing and packaging.

4

SMT/SMD assembly and through-hole components insertion

5

IC preprogramming

6

Function verification and burn in testing

7

Complete unit assembly (which including plastics, metal box, coil, cable inside and more)

8

Environmental coating

9

Engineering including end of life components, obsolete component replace and design support for circuit, metal and plastic enclosure

10

Packaging design and production of customized PCBA

11

100% quality assurance

12

High mixed, low volume order is also welcomed.

13

Full component procurement or the substitute components sourcing

14

UL,ISO9001:2008, ROSH ,REACH,SGS,HALOGEN-FREE compliant

PRODUCTION CAPABILITY OF PCB ASSEMBLY

Stencil Size Range

756 mm x 756 mm

Min. IC Pitch

0.30 mm

Max. PCB Size

560 mm x 650 mm

Min. PCB Thickness

0.30 mm

Min. Chip Size

0201 (0.6 mm X 0.3 mm)

Max. BGA Size

74 mm X 74 mm

BGA Ball Pitch

1.00 mm (Min) / F3.00 mm (Max)

BGA Ball Diameter

0.40 mm (Min) /F1.00 mm (Max)

QFP Lead Pitch

0.38 mm (Min) /F2.54 mm (Max)

Frequency of Stencil Cleaning

1 time / 5 ~ 10 Pieces

Type of Assembly

SMT and Thru-hole

Solder Type

Water Soluble Solder Paste,Leaded and Lead-free

Type of Service

Turn-key,Partial Turn-key or consignment

File Formats

Bill of Materials(BOM)

Gerber Files

Pick-N-Places(XYRS)

Components

Passive Down to 0201 Size

BGA and VF BGA

Leadless Chip Carries/CSP

Double Sided SMT Assembly

BGA Repair and Reball

Part Removal and Replacement

Component Packaging

Cut Tape,Tube,Reels,Loose Parts

Testing Method

X-RAY Inspection and AOI Test

Order of Quantity

High Mixed,Low Volume Order is also welcomed

Remarks: In order to get accurate quote,the following information is required

1

Complete Data of Gerber Files for the Bare PCB Board.

2

Electronic Bill of Material(BOM) / Parts list detailing manufacturer's part number, quantity usage of components for reference.

3

Please state whether we can use alternative parts for passive components or not.

4

Assembly Drawings.

5

Functional Test Time Per Board.

6

Quality Standards Required

7

Send Us Samples (if available)

8

Date of the quote needs to be submitted