Product description
Layers: 1 to 32
Maximum board size: 22 x 30-inch (558.8 x 762mm)
Minimum board thickness:
- 2-layer: 8mil (0.2mm)
- 4-layer: 16mil (0.4mm)
- 6-layer: 24mil (0.6mm)
- 8-layer: 32mil (0.8mm)
- 10-layer: 40mil (1.0mm)
Maximum board thickness: 200mil (5.08mm)
Minimum line width: 3mil (0.075mm)
Minimum line space: 3mil (0.075mm)
Minimum hole size: 6mil (0.15mm)
PTH diameter tolerance: ±2mil (0.05mm)
NPTH hole diameter tolerance: ±1mil (0.025mm)
Hole position deviation: ±2mil (0.05mm)
Outline tolerance: ± 4mil (0.1mm)
S/M pitch: 3mil (0.075mm)
Aspect ratio: 12:1
Finished copper weight: 10oz
Impedance control: ±5%
Insulation resistance: 1E + 12± (normal)
Thermal shock: 3 x 10sec at 288°
Warp and twist: ≤0.7%
Electric strength: >1.3KV/mm
Peel strength: 1.4N/mm
Solder mask abrasion: ≥6H
Flammability: 94V-0
Surface finishing: HASL, LF-HASL, ENIG, flash gold, immersiontin, immersion silver, OSP, gold finger, peelable mask and carbonprinting
Materials: FR4, rogers, Taconic, ARLON, BT, ceramic andaluminum
2-layer: 8mil (0.2mm)
4-layer: 16mil (0.4mm)
6-layer: 24mil (0.6mm)
8-layer: 32mil (0.8mm)
10-layer: 40mil (1.0mm)