6 Layer Green Multi Layer PCB FR4 HASL ( Lead Free ) Surfac
6 Layer Green Multi Layer PCB FR4 HASL ( Lead Free ) Surfac
6 Layer Green Multi Layer PCB FR4 HASL ( Lead Free ) Surfac

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6 Layer Green Multi Layer PCB FR4 HASL ( Lead Free ) Surfac

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Model No. : SYF-257
Brand Name : SYF
9yrs

Shenzhen, Guangdong, China

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Product description

6 Layer Green Multi Layer PCB FR4 HASL ( Lead Free ) Surface HDI Printed Circuit Board

Quick Details:

1. One of the largest and professional PCB (Printed Circuit Board) manufacturers in China with over 500

staff and 20 years’experience.

2. All kinds of surface finish is accepted,such as ENIG,OSP.Immersion Silver, Immersion Tin, Immersion

Gold, Lead-free HASL,HAL.

3. BGA,Blind&Buried Via and Impedance Control is accepted.

4. Advanced production equipment imported from Japan and Germany,such as PCB Lamination Machine,

CNC drilling machine,Auto-PTH line,AOI(Automatic Optic Inspection),Probe Flying Machine and so on.

5. Certifications of ISO9001:2008,UL,CE,ROHS,REACH,HALOGEN-FREE is meet.

6. One of the professional SMT/BGA/DIP/PCB Assembly manufacturers in China with 20

years’experience.

7. High speed advanced SMT lines to reach chip +0.1mm on integrated circuit parts.

8. All kinds of integrated circuits is available,such as SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-

BGA.

9. Also available for 0201 chip placement, through-hole components insertion and finished products

fabrication, testing and package.

10. SMD assembly and through-hole components insertion is accepted.

11. IC preprogramming is also accepted.

12. Available for Function verification and burn in testing.

13. Service for complete unit assembly,for example,plastics, metal box, coil, cable inside .

14. Environmental conformal coating to protect finished PCBA products.

15. Providing Engineering service as end of life components, obsolete component replace and design

support for circuit, metal and plastic enclosure.

16. Functional testing,repairs and inspection of the sub-finished and finished goods.

17. High mixed with low volume order is welcomed.

18. Products before delivery should be full quality checked, striving to 100% perfect.

19. One-stop service of PCB and SMT(PCB assembly) is supplied to our customers.

20. Best service with punctual delivery is always provided for our customers.

PRODUCT’S DETAILS
Raw Material FR-4(Tg 180)
Layer Count 6-Layer
Board Thickness 2.0mm
Copper Thickness 2.0oz
Surface Finish HASL(LEAD FREE)
Solder Mask Green
Silkscreen White
Min. Trace Width/Spacing 0.075/0.075mm
Min. Hole Size 0.25mm
Hole Wall Copper Thickness ≥20μm
Measurement 300×400mm
Packaging Inner: Vacuum-packed in soft plastic bales
Outer: Cardboard Cartons with double straps
Application Communication,automobile,cell,computer,medical
Advantage Competitive Price,Fast Delivery,OEM&ODM,Free Samples,
Special Requirements Buried And Blind Via, Impedance Control, Via Plug,
BGA Soldering And Gold Finger Are Acceptable
Certification UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

PRODUCTION CAPABILITY OF PCB

PROCESS Engineer
ITEMS Item
PRODUCTION CAPABILITY Manufacturing Capability
Laminate Type FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ,
ALUMINUM,CEM-1,CEM-3,TACONIC,ARLON,TEFLON
Thickness 0.2~3.2mm
Production Type Layer Count 2L-16L
Surface Treatment HAL,HASL,Gold Plating,Immersion Gold,OSP,
Immersion Silver,Immersion Tin,Lead Free HAL
Cut Lamination Max. Working Panel size 1000×1200mm
Inner Layer Internal Core Thickness 0.1~2.0mm
Internal width/spacing Min: 4/4mil
Internal Copper Thickness 1.0~3.0oz
Dimension Board Thickness Tolerance ±10%
Interlayer Alignment ±3mil
Drilling Manufacture Panel Size Max: 650×560mm
Drilling Diameter ≧0.25mm
Hole Diameter Tolerance ±0.05mm
Hole Position Tolerance ±0.076mm
Min.Annular Ring 0.05mm
PTH+Panel Plating Hole Wall copper Thickness ≧20um
Uniformity ≧90%
Outer Layer Track Width Min: 0.08mm
Track Spacing Min: 0.08mm
Pattern Plating Finished Copper Thickness 1oz~3oz
EING/Flash Gold Nickel Thickness 2.5um~5.0um
Gold Thickness 0.03~0.05um
Solder Mask Thickness 15~35um
Solder Mask Bridge 3mil
Legend Line width/Line spacing 6/6mil
Gold Finger Nickel Thickness ≧120u〞
Gold Thickness 1~50u〞
Hot Air Level Tin Thickness 100~300u〞
Routing Tolerance of Dimension ±0.1mm
Slot Size Min:0.4mm
Cutter Diameter 0.8~2.4mm
Punching Outline Tolerance ±0.1mm
Slot Size Min:0.5mm
V-CUT V-CUT Dimension Min:60mm
Angle 15°30°45°
Remain Thickness Tolerance ±0.1mm
Beveling Beveling Dimension 30~300mm
Test Testing Voltage 250V
Max.Dimension 540×400mm
Impedance Control
Tolerance
±10%
Aspect Ration 12:1
Laser Drilling Size 4mil(0.1mm)
Special Requirements Buried And Blind Via, Impedance Control, Via Plug,
BGA Soldering and Gold Finger Are Acceptable
OEM&ODM Service Yes
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