technical ALN aluminum nitride ceramic wafer chip tablet
technical ALN aluminum nitride ceramic wafer chip tablet
technical ALN aluminum nitride ceramic wafer chip tablet
technical ALN aluminum nitride ceramic wafer chip tablet
technical ALN aluminum nitride ceramic wafer chip tablet
technical ALN aluminum nitride ceramic wafer chip tablet
technical ALN aluminum nitride ceramic wafer chip tablet
technical ALN aluminum nitride ceramic wafer chip tablet

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technical ALN aluminum nitride ceramic wafer chip tablet

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Model No. : AIN 026
Brand Name : Hard
Type : Plate
Material : Alumina Ceramic
Style : Western
Usage : Home Decoration
Feature : Chinese
Processing : Casting
Color : White/Ivory
Shape : Round
Age : Modern
Surface Decoration : Glazed
Application : Machinery, Industry, Medical, Aerospace Etc.
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7yrs

Shenzhen, Guangdong, China

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Product description

industrial technical ALN aluminum nitride ceramic wafer chip tablet

Reputation depends on quality,  quality comes from Hard!


Aluninum Nitride Ceramic:

Aluminum nitride ceramic nickel is an element that strongly stabilizes austenite and expands the austenite phase region. In order to obtain a single austenite structure, the minimum nickel content required when the steel contains 0.1% carbon and 18% chromium is about 8%, which is the basic score of the most famous 18-8 chromium-nickel austenitic stainless steel. In austenitic stainless steel, with the increase of nickel content, the residual ferrite can be completely eliminated, and the formation of σ phase is significantly reduced At the same time, the martensite-to-hydrocarbon temperature decreases, even without the λ→M phase transition, but the increase of nickel content will reduce the solubility of carbon in austenitic stainless steel, thereby increasing the tendency of carbide precipitation. The influence of nickel on the mechanical properties of austenitic stainless steels, especially chromium-nickel austenitic stainless steels, is mainly determined by the influence of nickel on the stability of austenite. Within the range of nickel content where martensite transformation may occur in the steel, As the nickel content increases, the strength of the steel decreases and the plasticity increases. The chromium-nickel austenitic stainless steel with stable austenitic structure has excellent toughness (including extremely low temperature toughness), so it can be used as low temperature steel, which is well known. For the chromium-manganese austenitic stainless steel with stable austenite structure, the addition of nickel can further improve its toughness. Nickel can also significantly reduce the cold work hardening tendency of austenitic stainless steels. This is mainly due to the increased stability of austenite, which reduces or even eliminates the martensite transformation during cold working. At the same time, it has no effect on the cold work hardening of austenite itself. Too obvious, the influence of stainless steel cold work hardening tendency.



Using AIN ceramics for heat resistance, melt erosion and thermal shock resistance, GaAs crystal crucible, Al evaporating dish, magnetic fluid power generation device and high temperature turbine corrosion resistant parts can be fabricated, and its optical properties can be used as an infrared window. The aluminum nitride film can be made into a high frequency piezoelectric element, a very large scale integrated circuit substrate, or the like.
Aluminum nitride heat-resistant, resistant to molten metal erosion, stable to acid, but easy to be eroded in alkaline solution. The AIN fresh surface is exposed to moist air and reacts to form a very thin oxide film. By utilizing this property, it can be used as a crucible and a die-casting mold material for smelting metals such as aluminum, copper, silver, and lead. AIN ceramics have good metallization properties and can be widely used in the electronics industry as an alternative to toxic cerium oxide.

Data Sheet:

Ø (1) high thermal conductivity (about 320W / m · K), close to BeO and SiC, more than 5 times that of Al2O3;
Ø(2) The thermal expansion coefficient (4.5×10-6°C) is matched with Si (3.5-4×10-6°C) and GaAs (6×10-6°C);
Ø (3) excellent electrical properties (dielectric constant, dielectric loss, volume resistivity, dielectric strength);
Ø(4) good mechanical properties, higher flexural strength than Al2O3 and BeO ceramics, can be sintered at normal pressure;
Ø (5) good optical transmission characteristics;
Ø(6) non-toxic;


Application industry:

 Aluminum nitride powder has high purity, small particle size and high activity, and is the main raw material for manufacturing high thermal conductivity aluminum nitride ceramic substrate.
Aluminum nitride ceramic substrate, high thermal conductivity, low expansion coefficient, high strength, high temperature resistance, chemical corrosion resistance, high resistivity, small dielectric loss, is an ideal large-scale integrated circuit heat sink substrate and packaging materials.

AIN chip

Why Choose Us?
1.12 years of professional production industrial ceramics factory
2.High quality products with low price
3.High precision parts with lowest tolerance
4.Short time for production 
5.Has a group of experienced, professional and efficient R&D team
6.Has a good reputation in China and abroad.

7.MOQ is not limited, small quantity is welcome.

8.Vigorous team and good after-sales service


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FAQ

Q: Are you trading company or manufacturer ?
A: We are factory.
 
Q: How long is your delivery time?
A: Generally it is 5-10 days if the goods are in stock. or it is 15-30 days if the goods are not in stock, it is according to quantity.
 
Q: Do you provide samples ? is it free or extra ?
A: Yes, we could offer the sample for free charge but do not pay the cost of freight.
Q: What is your terms of payment ?

A: Payment<=1000USD, 100% in advance. Payment>=1000USD, 50% T/T in advance ,balance before shippment.

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