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solder paste,leaded solder paste
| Model No. : | CF818 |
|---|---|
| Brand Name : | SUNY |
Product description
Our factory is mainly to produce the PCB production equipment, we have all the machine which used for the entire PCB production like the: PCB cutting machine PCB CNC drilling and milling machine Circuit board buffing machine Through-hole machine Screen printing machine Laser printer Film laminator Spray imaging machine Spray etching machine Spray stripping machine Tin-sinking machine Pick and place machine Reflow Oven Our machine can used for the 200*300mm/300mm*400/400*500mm etc. PCB boards. You can also inform us your PCB size, then we can custom the machine for you!!!! We can also supply the chemicals and reagents & consumables for the PCBs. Solder paste with lead CF 818 1. The use of solder paste and attentions Items | Content |
Solder paste return temperature | Solder paste is usually stored in the refrigerator, the temperature at 5 ~ 10 °C, when used, solder paste must be removed from the refrigerator back to room temperature (about 2-4 hours). The solder paste should not be put back to the original tank when not fully used before work ends, and should be stored separately. |
Printing speed | 25~50mm/s |
Scraper hardness | 80~90DUROMETER |
Roller pressure | 0.3-0.5 mPa |
Printing method | Stainless steel sheet contact printing |
Working life | 6~8 hours |
Work environment | Temperature 20 ~ 25 °C, relative humidity below 70% |
Mixing time | Suggest around 3 ~ 5 minutes |
Minimum package | 500g/bottle |
Alloy | Content(%) | Sn63Pb37 | Titration | |
Shape | Spherosome | Microscopic method | ||
Mesh number(μm) | 25-45 | Sieving/ optical chromatography | ||
|
Flux Paste | Halogen(%) | <0.04 | Potentiometric titration | |
SIR | Before the heat and wet | ≥1×1012Ω | 25mil combplate | |
After the heat and wet | ≥1×1010Ω | 4°C 90%RH96Hrs | ||
Aqueous solution impedance | ≥1×105Ω | Conductivity method | ||
PH value | 4.9 | Acidity method | ||
| Solder paste
| Metal content (%) | 90-91 | Gravimetric method | |
Viscosity(Pa.s) | 200-400 | Rotary viscosity | ||
Copper mirror corrosion | Pass | 40°C90%RH96Hrs | ||
Rate of spread(%) | ≥91 | 230°C 30Sec | ||
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