Product description
Paper fabric material
HB material is available
Board thicknesses: 0.8 to 2.4mm minimum
Holes and slots can be punched or routed
Excellent insulation and shielding properties
Material range:
- HB, VO, XPC, FR1, FR2, CEM1, CEM3, FR4
- Materials: no copper, glass fabric or paper fabric base
Capability range:
- Hard gold/soft gold plating
- SMOBC (solder mask over bare copper)
- HASL (hot air solder leveling)
- Peelable mask
- Carbon/silver through holes, carbon bridges, contacts
- Milling cavity boards
- 0.003-inch line/0.003-inch spacing
- Gold finger contact board
- Range: from single layer up to eight layers
- Board thickness range: from 0.15 to 2.40mm
- Flexible boards
- Push back, slots, routing, blanking outlines
- Immersion/chemical gold plating
- Customized specifications are welcome
- Small orders are welcome
Production capacity:
- Double-sided boards: 20,000sqm/month
- Multilayer boards: 3,000sqm/monthly
HB, VO, XPC, FR1, FR2, CEM1, CEM3, FR4
Materials: no copper, glass fabric or paper fabric base
Hard gold/soft gold plating
SMOBC (solder mask over bare copper)
HASL (hot air solder leveling)
Peelable mask
Carbon/silver through holes, carbon bridges, contacts
Milling cavity boards
0.003-inch line/0.003-inch spacing
Gold finger contact board
Range: from single layer up to eight layers
Board thickness range: from 0.15 to 2.40mm
Flexible boards
Push back, slots, routing, blanking outlines
Immersion/chemical gold plating
Customized specifications are welcome
Small orders are welcome
Double-sided boards: 20,000sqm/month
Multilayer boards: 3,000sqm/monthly