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SMT, short for surface mount technology, a PCB (printed circuit board) assembly technology, refers to the technology of soldering components directly to the surface of the PCB to replace THT (by-Hole Technology) must use drilled holes.
The detailed steps of PCB SMT assembly are as follows:
solder paste printing
Inspection(AOI or Visual)
Chip mounting
Inspection(AOI or Visual)
Reflow soldering(AOI or Visual)
Inspection
Rework
The SMT assembly procedure can be simplified into the following four steps: solder paste printing, chip mounting, reflow soldering and inspection.
Materials used in SMT assembly include solder pastes, adhesives, fluxes, cleaners, heat transfer media, etc.
The assembly method and process flow of SMT mainly depend on the type of surface mount components (SMA), the types of components used and the conditions of assembly equipment.
Selecting the appropriate assembly method according to the specific requirements of the SMT assembly product and the conditions of the assembly equipment is the basis for efficient and low-cost assembly production, and is also the main content of the SMT process design.
In general, SMA can be divided into 3 types of single-sided mixed, double-sided mixed and full surface assembly, a total of 6 assembly methods
1. Single-sided mixed assembly method
The first type is single-sided hybrid assembly, that is, SMC/SMD and through-hole components (17HC) are mixed on different sides of the PCB, but the welding surface is only one side. This type of assembly method adopts single-sided PCB and wave soldering (now generally double wave soldering is used)
2. Double-sided hybrid assembly method
The second type is double-sided hybrid assembly. SMC/SMD and T.HC can be mixed and distributed on the same side of the PCB. At the same time, SMC/SMD can also be distributed on both sides of the PCB. Double-sided hybrid assembly uses double-sided PCB, dual wave soldering or reflow soldering. In this type of assembly method, there is also the difference between pasting first or pasting SMC/SMD later. Generally, it is reasonably selected according to the type of SMC/SMD and the size of the PCB. Usually, the first method is used.
This type of assembly method has a very high assembly density because SMC/SMD is mounted on one or both sides of the PCB, and the leaded components that are difficult to be surface-assembled are inserted into the assembly.
3. Full surface assembly method
The third type is full surface assembly, with only SMC/SMD and no THC on the PCB. Since the current components have not yet fully realized SMT, there are not many such assembly forms in practical applications. This type of assembly method is generally assembled on a thin-line patterned PCB or ceramic substrate using fine-pitch devices and reflow soldering processes.