Metal Etching Process Leadframes

High Precision  Etching On SUS Chemical Etching Lead Frame

A lead frame (pronounced /lid/ LEED) is a metal structure inside a chip package that carries signals from the die to the outside, used in DIP, QFP and other packages where connections to the chip are made on its edges.

The lead frame consists of a central die pad, where the die is placed, surrounded by leads, metal conductors leading away from the die to the outside world. The end of each lead closest to the die ends in a bond pad. Small bond wires connect the die to each bond pad. Mechanical connections fix all these parts into a rigid structure, which makes the whole lead frame easy to handle automatically.

About us

SHAOXING HUALI ELECTRONICS CO., LTD. is the earliest manufacturer of etching production process in China and is also a national high-tech enterprise specialized in producing metal etching products.