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Jewelry/ Hardware Gold Plating Machine
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| Model No. : | ZC |
|---|
Dongguan Zhicheng Vacuum Technology Co., Ltd.
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Product description
Jewelry/ Hardware Gold Plating Machine gradually play a leading role technique of supttering coating field. The reason why this machine advantage with DC sputtering coating.
characteristic :
1) surmount anode disppear phenomenon
2) Recede or eliminate abnormal arc light discharge of target
Therefore, its had advanced performance stability of sputtering processing and deposit rate of dielectric film.
We had developed plane target, columnar target, twin targets ect. MF sputtering target struture and layout
It is widely used in thewatchband, watchcase, mobile shell, hardware tableware, etc. Lt can coat TiN, TiC, TiCN, TiAIN, TrN, Cu, Au. And other decorative films.
our company can design the vacuum coating machine ,according to customers'requirement .
characteristic :
1) surmount anode disppear phenomenon
2) Recede or eliminate abnormal arc light discharge of target
Therefore, its had advanced performance stability of sputtering processing and deposit rate of dielectric film.
We had developed plane target, columnar target, twin targets ect. MF sputtering target struture and layout
It is widely used in thewatchband, watchcase, mobile shell, hardware tableware, etc. Lt can coat TiN, TiC, TiCN, TiAIN, TrN, Cu, Au. And other decorative films.
our company can design the vacuum coating machine ,according to customers'requirement .
| Mode
Dimension |
ZC-900 | ZC-1100 | ZC-1250 |
| 900*1000mm | 1100*1000mm | 1250*1100mm | |
|
Coating mode and main confirguration |
Six multi-arc targets + one set of column targets + one set of plane rectangle magnetron sputtering targets |
Six multi-arc targets + a pair of twin (MF)magnetron sputtering targets |
Twelve multi-arc targets + two sets of plane rectangle magnetron sputtering targets+ a pair of twin (MF)magnetron sputtering targets |
| Power source | Electric arc power, DC magnetron power, MF magnetron power, filament power, pulse power, linear ionized source. | ||
| Process gas control | Quality flowmeter + electromagnetism ceramic valve | ||
| Vacuum chamber structure | Vertical single(side) door, pump system postposition, double water-cooling | ||
| Vacuum system | Molecule pump +Roots pump +Mechanical pump(5.0*10 -5 Pa)
Diffusion pump +Roots pump +Mechanical pump(5.0*10 -4 Pa) |
||
| Workpiece baking temperature |
Normal temperature to 350 centi-degree PID control, radiation heating. |
||
| Workpiece motion mode | Public rotation Frequency control: 0-20 rotation per minute | ||
| Measure mode | Number display composite vacuum gauge: from atmosphere to 1.0*10 -5 Pa | ||
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