High frequency solid lamination glue

High frequency solid lamination glue
Product introduction:
High frequency principle: medium frequency and high frequency induction heating is to convert power frequency (50HZ) alternating current into alternating current with a frequency of generally 1KHZ to hundreds of KHZ, or even higher frequency. Then, it acts on the material and glue in the magnetic field. Using the eddy current effect, an induced rotating current (ie eddy current) proportional to the magnetic field strength is generated in the material and glue. The rotating current converts it into heat energy with the help of the resistance in the material and the glue. Together, the temperature of the material and the glue rises rapidly, so that the glue is quickly heated and solidified.It is a kind of wood glue and also a water based adhesive

It is also suitable for high-frequency splicing of medium-hard materials such as southwest birch, rubber wood, miscellaneous wood, catalpa, elm, etc. JAS standard room temperature water and boiling water soaking and peeling tests have good performance, and the European D4 waterproof level

Glue For Wooden Door and Floor Compound Glue

Product advantages:
Fast curing and high efficiency, high solid content, fast curing and high efficiency, good bonding strength and weather resistance.
High shear strength, fast curing speed, ten-ring certification, European standard, Japanese JAS standard environmental protection product, meeting the industrial strength requirements of glulam.