Product description
Flame retardance: V2
Single-sided FR4 PCB
Board types:
- Multilayer rigid PCB's up to 18 layers
- Flexible and flex-rigid circuits up to 18 layers
- Controlled impedance
- HDI (high density interconnect)
- Blind and buried via holes
- RoHS and UL compliant on request
Substrates:
- FR4 standard epoxy and high temp versions
- Polyimide, polyester and PET
- PTFE (polytetrafluoroethylene) and Droid (glass reinforced PTFE composite)
- Aluminum based materials
- Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
Board options:
- CNC routing
- Scoring (V-Grooving)
- Gold on nickel contact fingers
- LPSM (liquid photo image-able solder mask) range of colors available
- Peel able solder mask
- Screened conductive Inks (carbon)
- Bare board electrical testing
Board finishes:
- Immersion silver
- Immersion gold
- Lead free or HASL (hot air solder leveling)
- OSP (organic surface preservative)
- Gold finger
- Plating gold
- Immersion tin
We also offer:
- PCB design
- Circuit layout and drafting
- PCB copy
Multilayer rigid PCB's up to 18 layers
Flexible and flex-rigid circuits up to 18 layers
Controlled impedance
HDI (high density interconnect)
Blind and buried via holes
RoHS and UL compliant on request
FR4 standard epoxy and high temp versions
Polyimide, polyester and PET
PTFE (polytetrafluoroethylene) and Droid (glass reinforced PTFE composite)
Aluminum based materials
Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
CNC routing
Scoring (V-Grooving)
Gold on nickel contact fingers
LPSM (liquid photo image-able solder mask) range of colors available
Peel able solder mask
Screened conductive Inks (carbon)
Bare board electrical testing
Immersion silver
Immersion gold
Lead free or HASL (hot air solder leveling)
OSP (organic surface preservative)
Gold finger
Plating gold
Immersion tin
PCB design
Circuit layout and drafting
PCB copy