Product description
PCB assembly
Surface mounted technology
Electronic manufacture
Stencil size/range: 736 x 736mm
Minimum IC pitch: 0.30mm
Maximum PCB size: 410 x 360mm
Minimum PCB thickness: 0.35mm
Minimum chip size: 0201 (0.2 x 0.1)/0603 (0.6 x 0.3mm)
Maximum BGA size: 74 x 74mm
BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum)
BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum)
QFP lead pitch: 0.38mm (minimum), 2.54mm (maximum)
High quality with reasonable price
Fast lead time
OEM/ODM
ISO, RoHS, UL and more certifications
Providing PCB assembly service