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$10.00
≥1 Piece/Pieces
place of origin : | China |
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Product description
Legend:White, Black,Red,Yellow
No | Items | Capabilities(Order size/Delivery area <5m2) | Capabilities(Order size/Delivery area ≥5m2) | |
1 | Materia l | HDI PCB material |
IT-180A、S1000-2、TU-768(TU-752)、TU-862HF、IT-170GRA1、 S7439C、R-5775G、IT-968、TU-883、IT-988GSE、R-5785N、 Meteorwave4000 |
IT-180A、S1000-2、TU-768(TU-752)、R-5775G、R-5785N |
2 | High CTI | S1151G(Halogen free)) | S1151G(Halogen free)) | |
3 | PI material | VT-901、VT-90H、85N | VT-901、VT-90H、85N | |
4 | HighSpeed material |
TU-862 HF(Halogen free))、IT-170GRA1(Halogen free)、FR408HR 、TU-872 SLK、R-5725S、TU-872 SLK SP、N4103-13、N4103-13 EP、 N4103-13 SI、N4103-13 EPSI、N4800-20 SI、S7439C、R-5775G、IT- 968、R-5775N、IT-968 SE、TU-883、R-5775K、R-5785N、 Meteorwave4000、IT-988G SE、TU-933+ |
TU-862 HF(Halogen free))、IT-170GRA1(Halogen free))、TU-872 SLK、 R-5725S、TU-872 SLK SP、N4103-13、N4103-13 EP、N4103-13 SI、N4103-13 EPSI、R-5775G、IT-968、R-5775N、IT-968 SE、TU-883、R-5785N、 Meteorwave4000、IT-988G SE、TU-933+ |
|
5 | High Frequency CCL material |
Aerowave 300、ZYC8300、ZYF3000CA-P、RO4730G3、RO4533、RO4533 Lopro、LNB33、S7136H、HC35、RO4350B、RO4350B Lopro、TLF-35、RF- 35、RF-35TC、RF-45、RF-60TC、TLY-5、RT5880、ZYF220D、DiClad 880 、TLX-8、F4BM-2、RO4725JXR、RO4725JXR lopro、TLX-9、GF255、 ZYF265D、TSM-DS3M、RT6002、TSM-DS3、RO4003C、RO4003C Lopro、 mmWave77、RO3003、RT6010LM、AD1000、AD1000L、TP-2、TMM10 |
Aerowave 300、RO4730G3、RO4533、RO4533 Lopro、S7136H、RO4350B、 RO4350B Lopro、RF-35、RF-35TC、RF-45、RF-60TC、TLY-5、RT5880、DiClad 880、TLX-8、RO4725JXR、RO4725JXR lopro、TSM-DS3M、RT6002、RO4003C、 RO4003C Lopro、RO3003、RT6010LM | |
6 | High Frequency PP material |
(FR-28-0040-50、FR-25-0021-45、FR-26-0025-60、FR-27-0045-35、 FR-27-0050-40)、Aerobond350、Synamic 6B、RO4450F |
Synamic 6B、RO4450F | |
7 | Metal substrate PCB |
T110、T111、T1112、T112B、T112C、VT-4A1、VT-4A2、VT-4B3、VT-4B5 、92MCL、1KA04、1KA06、1KA08、VT-4A2、T512、 |
T110、T111、T1112、T112B、T112C、VT-4A1、VT-4A2、VT-4B3、VT-4B5、 92MCL、1KA04、1KA06、1KA08、VT-4A2、T512、 | |
8 | Metal substrate PCB PP | ST115B、VT-4A2、1KA04、1KA06、1KA08 | ST115B、VT-4A2、1KA04、1KA06、1KA08 | |
9 | Hybrid laminating | Rogers、Taconic、Arlon、Nelco&fr4、high speed material & FR4、 High Frequency material & high speed material | Rogers、Taconic、Arlon、Nelco与FR-4、high speed material & FR4、High Frequency material & high speed material | |
10 |
PCB type |
Rigid PCB |
Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、 Heavy copper power PCB、Backdrill、Semiconductor Test products. |
Backplane、HDI、High multi-layer blind&buried PCB、Backdrill&Heavy copper power PCB |
11 | Buildin gs | Blind&buried via type | mechanical blind&burried vias with less than 3 times laminating | mechanical blind&burried vias with less than 2 times laminating |
12 | HDI | 1+n+1、1+1+n+1+1、2+n+2、3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1、1+1+n+1+1、2+n+2((n buried vias≤0.3mm),Laser blind via can be filling plating | |
No | Items | Capabilities(Order size/Delivery area <5m2) | Capabilities(Order size/Delivery area ≥5m2) | |
13 | Surface Finish treatme nt | Surface Finish treatment(lead free) |
Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、 HASL Lead free、OSP、ENEPIG、Soft gold、 Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge |
Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、 Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge |
14 |
Surface Finish treatment(leaded) |
HASL | HASL | |
15 | Aspect ratio |
10:1(HASL/Lead free HASL,ENIG,Immersion silver、Immersion Tin,ENEPIG);8:1(OSP) |
10:1(HASL/Lead free HASL,ENIG,Immersion silver、Immersion Tin, ENEPIG);8:1(OSP) |
|
16 | Max finished size |
HASL/Lead free HASL 22"*24";gold finger 24"*24";hard gold 24"*32";ENIG 21"*27";FLASH GOLD21"*48";Immersion tin 16"*21";immersion silver:width max 24",length no limited; OSP 610*720mm; |
HASL/Lead free HASL22"*24";gold finger 24"*24";hard gold 24"*32"; ENIG 21"*27";FLASH GOLD21"*48";Immersion tin 16"*21";immersion silver:width max 24",length no limited;OSP 610*720mm; | |
17 | MIN finished size | HASL 5"*6";Lead free HASL 6"*10";gold finger 12"*16";hard gold 3"*3";FLASH GOLD 8"*10";Immersion tin/silver 2"*4"; OSP2"*2"; | HASL 5"*6";Lead free HASL 6"*10";gold finger 12"*16";hard gold 3"*3";FLASH GOLD 8"*10";Immersion tin/silver 2"*4";OSP2"*2"; | |
18 | PCB thickness |
HASL/Lead free HASL 0.6-4.0mm;gold finger 1.0-3.2mm;hard gold 0.1-8.0mm;ENIG 0.2-7.0mm;FLASH GOLD 0.15-5.0mm; Immersion tin 0.4-5.0mm;immersion silver 0.2-4.0mm;OSP 0.2- 6.0mm; |
HASL/Lead free HASL 0.6-4.0mm;gold finger 1.0-3.2mm;hard gold 0.1- 5.0mm;ENIG 0.2-7.0mm;FLASH GOLD 0.15-5.0mm;Immersion tin 0.4- 5.0mm;immersion silver 0.2-4.0mm;OSP 0.2-6.0mm; | |
19 | MAX high to gold finger | 1.5inch | 1.5inch | |
20 | Min space between gold fingers | 5mil | 5mil | |
21 | Min block space to gold fingers | 5mil | 5mil | |
22 |
Plating /coatin g thickne ss |
HASL |
2-40μm (0.4μm on large tin area of Leaded HASL, 1.5μm on large tin area of HASL lead free) |
2-40μm (0.4μm on large tin area of Leaded HASL, 1.5μm on large tin area of HASL lead free) |
23 | OSP | osp thickness:0.2-0.6μm | osp thickness:0.2-0.6μm | |
24 | ENIG | gold thickness :0.05-0.10μm,Nickelthickness :3-8μm | gold thickness :0.05-0.10μm,Nickelthickness :3-8μm | |
25 | Immersion silver | silver thickness :0.15-0.4μm | silver thickness :0.15-0.4μm | |
26 | Immersion tin | tin thickness :≥1.0 | tin thickness :≥1.0 | |
27 | Hard gold |
gold thickness :0.10-1.5μm(Dry film diagram plating process),gold thickness :0.10-4.0μm(no Dry film diagram plating process) |
gold thickness :0.10-1.5μm(Dry film diagram plating process),gold thickness :0.10-4.0μm(no Dry film diagram plating process) | |
28 | Soft gold |
gold thickness :0.10-1.5μm(Dry film diagram plating process),gold thickness :0.10-4.0μm(no Dry film diagram plating process) |
gold thickness :0.10-1.5μm(Dry film diagram plating process),gold thickness :0.10-4.0μm(no Dry film diagram plating process) | |
29 | ENEPIG |
gold thickness :0.05-0.10μm,Nickelthickness :3-8μm; pd thickness:0.05-0.15μm(welding) pd thickness:0.075-0.20μm(Gold wire bond) pd thickness:≥0.3μm(special function) |
gold thickness :0.05-0.10μm,Nickelthickness :3-8μm; pd thickness:0.05-0.15μm(welding) pd thickness:0.075-0.20μm(Gold wire bond) pd thickness:≥0.3μm(special function) |
|
30 | Flash Gold |
gold thickness :0.025-0.10μm,Nickelthickness :≥3μm,bass copper max thickness 1OZ |
gold thickness :0.025-0.10μm,Nickelthickness :≥3μm,bass copper max thickness 1OZ |
|
No | Capabilities(Order size/Delivery area <5m2) | Capabilities(Order size/Delivery area ≥5m2) | ||
31 | Gold finger | gold thickness :0.25-1.5μm,Nickelthickness :≥3μm | gold thickness :0.25-1.5μm,Nickelthickness :≥3μm | |
32 | Carbon | 10-50μm | 10-50μm | |
33 | Soldermask |
on copper area(10-18μm)、on via pad(5-8μm)、on circuits around the corner, ≥5μm ,just for one-time print & copper thickness need lower than 48um |
on copper area(10-18μm)、on via pad(5-8μm)、on circuits around the corner, ≥5μm ,just for one-time print & copper thickness need lower than 48um |
|
34 | Blue plastic | 0.20-0.80mm | 0.2-0.4mm | |
35 | Hole | 0.1/0.15/0.2mm MAX thickness of mechanical hole | 0.8mm/1.6mm/2.5mm | 0.6mm/1.2mm/1.6mm |
36 | Min laser drilling size | 0.1mm | 0.1mm | |
37 | Max laser drilling size | 0.15mm | 0.15mm | |
38 | Finshed mechanical hole size | 0.10-6.2mm(corresponding drilling tool size0.15-6.3mm) | 0.15-6.2mm(corresponding drilling tool size0.2-6.3mm) | |
39 | A、Min finished hole size for PTFE material and hybrid PCB is 10mil(corresponding drilling tool size 14mil) | A、Min finished hole size for PTFE material and hybrid PCB is 10mil(corresponding drilling tool size 14mil) | ||
40 | B、Max finished hole size for blind & buried via is 12mil(corresponding drilling tool size 16mil) | B、Max finished hole size for blind & buried via is 12mil(corresponding drilling tool size 16mil) | ||
41 | C、Max finished hole size for via-in-pad pluged with solder mask is 18mil(corresponding drilling tool size 21.65mil | C、Max finished hole size for via-in-pad pluged with solder mask is 18mil(corresponding drilling tool size 21.65mil | ||
42 | D、Min connecting hole size is 14mil(corresponding drilling tool size is 18mil) | D、Min connecting hole size is 14mil(corresponding drilling tool size is 18mil) | ||
43 | E、Min half-hole(pth)size is 12mil(corresponding drilling tool size is 16mil) | E、Min half-hole(pth)size is 12mil(corresponding drilling tool size is 16mil) | ||
44 | MAX aspect ratio for Hole plate | 20:1(hole diameter>8mil) | 15:1 | |
45 | Max aspect ratio for laser via filling plating | 1:1 | 0.9:1 | |
46 |
Max aspect ratio for mechanical depth-control drilling board(Blind hole drilling depth/blind hole size) |
1.3:1(hole diameter≤0.20mm),1.15:1(hole diameter≥0.25mm) | 0.8:1,hole diameter≥0.25mm | |
47 | Min. depth of Mechanical depthcontrol(backdrill) | 0.2mm | 0.2mm | |
48 | Min gap between hole wall and conductor (None blind and buried via PCB) |
PIN-LAM:3.5mil(≤4L),4mil(5-8L),4.5mil(9-12L);5mil (13-16L),6mil(≥17L) |
7mil(≤8L)、9mil(10-14)、10mil(>14L) | |
49 |
Min gap between hole wall conductor (Blind and buried via PCB) |
7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | |
No | Capabilities(Order size/Delivery area <5m2) | Capabilities(Order size/Delivery area ≥5m2) | ||
50 |
Min gab between hole wall conductor (Laser blind hole buried via PCB) |
7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | |
51 |
Min space between laser holes and conductor |
5mil | 6mil | |
52 |
Min space bwteen hole walls in different net |
10mil | 10mil | |
53 |
Min space bwteen hole walls in the same net |
6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | |
54 | Min space bwteen NPTH hole walls | 8mil | 8mil | |
55 | Hole location tolerance | ±2mil | ±2mil | |
56 | NPTH tolerance | ±2mil | ±2mil | |
57 | Pressfit holes tolerance | ±2mil | ±2mil | |
58 | Countersink depth tolerance | ±0.15mm | ±0.15mm | |
59 | Countersink hole size tolerance | ±0.15mm | ±0.15mm | |
60 | Pad(rin g) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via | 10mil(for 4mil laser via),11mil(for 5mil laser via |
61 |
Min Pad size for mechanical drillings |
16mil(8mildiameter) | 16mil(8mildiameter) | |
62 | Min BGA pad size | HASL:10mil,,Lead free min BGA (solder mask 16mil,etching 10mil), other surface technics are 7mi | HASL:10mil,Lead free min BGA (solder mask 16mil,etching 10mil), flash gold 7 mil,other surface technics are 10mil | |
63 | Pad size tolerance(BGA) | +/-1.2mil(pad <12mil);+/-10%(pad≥12mil) | +/-1.5mil(pad<10mil);+/-15%(pad≥10mil) | |
64 | Inner layer | 1/2OZ:3/3mil | 1/2OZ: 3/3mil | |
65 | 1OZ: 3/4mil | 1OZ: 3/4mil | ||
66 | 2OZ: 4/5mil | 2OZ: 4/5.5mil | ||
67 | 3OZ: 5/8mil | 3OZ: 5/8mil | ||
68 | 4OZ: 6/11mil | 4OZ: 6/11mil | ||
69 | 5OZ: 7/13.5mil | 5OZ: 7/14mil | ||
70 | 6OZ: 8/15mil | 6OZ: 8/16mil | ||
71 | 7OZ: 9/18mil | 7OZ: 9/19mil | ||
72 | 8OZ: 10/21mil | 8OZ: 10/22mil | ||
73 | 9OZ: 11/24mil | 9OZ: 11/25mil | ||
74 | 10OZ: 12/27mil | 10OZ: 12/28mil | ||
No | Width/S pace | Capabilities(Order size/Delivery area <5m2) | Capabilities(Order size/Delivery area ≥5m2) | |
75 | Outer layer | 1/3OZbase copper:3/3mil | 1/3OZbase copper:3.5/4mil | |
76 | 1/2OZbase copper:3.5/3.5mil | 1/2OZbase copper:3.9/4.5mil | ||
77 | 1OZbase copper: 4.5/5mil | 1OZbase copper: 4.8/5.5mil | ||
78 | 1.43OZbase copper(positive):4.5/6 | 1.43OZbase copper(positive):4.5/7 | ||
79 | 1.43OZbase copper(negative):5/7 | 1.43OZbase copper(negative):5/8 | ||
80 | 2OZbase copper: 6/7mil | 2OZbase copper: 6/8mil | ||
81 | 3OZbase copper: 6/10mil | 3OZbase copper: 6/12mil | ||
82 | 4OZbase copper: 7.5/13mil | 4OZbase copper: 7.5/15mil | ||
83 | 5OZbase copper: 9/16mil | 5OZbase copper: 9/18mil | ||
84 | 6OZbase copper: 10/19mil | 6OZbase copper: 10/21mil | ||
85 | 7OZbase copper: 11/22mil | 7OZbase copper: 11/25mil | ||
86 | 8OZbase copper: 12/26mil | 8OZbase copper: 12/29mil | ||
87 | 9OZbase copper: 13/30mil | 9OZbase copper: 13/33mil | ||
88 | 10OZbase copper: 14/35mil | 10OZbase copper: 14/38mil | ||
89 | Width tolerance | ≤10mil:+/-1.0mil | ≤10mil:+/-20% | |
90 | >10mil:+/-1.5mil | >10mil:+/-20% | ||
91 | Solderm ask |
MAX drilling tool size for via filled with Soldermask (double side) |
0.9mm | 0.9mm |
92 | Soldermask color |
Green matte/glossy, Black matte/glossy, Blue matte/glossy, Red, White,Yellow, |
Green matte/glossy, Black matte/glossy, Blue matte/glossy, Red, White,Yellow, |
|
93 | Silkscreen color | White, Yellow, Black | White, Yellow, Black | |
94 |
MAX hole size for via filled with Blue glue aluminium |
5mm | 4.5mm | |
95 |
Finish hole size for via filled with resin |
0.1-1.0mm | 0.1-1.0mm | |
96 |
Max aspect ratio for via filled with resin board |
12:1 | 8:1 | |
97 | Min width of soldermask dam |
base copper≤0.5OZ:4mil(best3.5mil,solder mask can't be white/black),5.5mil(best is 5mil,black/white),8.0mil(on copper area) |
base copper≤0.5OZ:4mil(best3.5mil,solder mask can't be white/black),5.5mil(best is 5mil,black/green),8.0mil(on copper area) |
|
98 | base copper1OZ:4mil(green),5mil(solder mask can't be white/black),5.5mil(black/white),8.0mil(on copper area) | base copper1OZ:4mil(green),5mil(solder mask can't be white/black),5.5mil(black/white),8.0mil(on copper area) | ||
99 | base copper1.43OZ:4mil(green),5.5(can't be black/white), 6mil(black/white),8.0mil(on copper area) | base copper1.43OZ:4mil(green),5.5(solder mask can't be white/black),6mil(black/white),8.0mil(on copper area) | ||
100 | base copper2-4OZ:6mil,8mil(on copper area) | base copper2-4OZ:6mil,8mil(on copper area) | ||
No | Capabilities(Order size/Delivery area <5m2) | Capabilities(Order size/Delivery area ≥5m2) | ||
101 | Routing |
Min space of the V-CUT does not reveal the copper ( Central Line of v-cut to internal/external circuits,H means board thickness) |
H≤1.0mm:0.3mm(20°V-CUT)、0.33mm(30°)、0.37mm(45°); | H≤1.0mm:0.3mm(20°V-CUT)、0.33mm(30°)、0.37mm(45°); |
102 | 1.0<H≤1.6mm:0.36mm(20°)、0.4mm(30°)、0.5mm(45°); | 1.0<H≤1.6mm:0.36mm(20°)、0.4mm(30°)、0.5mm(45°); | ||
103 | 1.6<H≤2.4mm:0.42mm(20°)、0.51mm(30°)、0.64mm(45°); | 1.6<H≤2.4mm:0.42mm(20°)、0.51mm(30°)、0.64mm(45°); | ||
104 | 2.4<H≤3.2mm:0.47mm(20°)、0.59mm(30°)、0.77mm(45°); | 2.4<H≤3.2mm:0.47mm(20°)、0.59mm(30°)、0.77mm(45°); | ||
105 | V-CUT symmetrical tolerance | ±4mil | ±4mil | |
106 | MAX V-CUT lines | 100 | 100 | |
107 | V-CUT angle tolerance | ±5° | ±5° | |
108 | V-CUT angle | 20、30、45° | 20、30、45° | |
109 | Gold finger bevelling | 20、30、45° | 20、30、45° | |
110 | Gold finger bevelling tolerance | ±5° | ±5° | |
111 |
Min space of gold finger chamfering noninterference tab |
2.5mm | 7mm | |
112 | Min gap between the side of gold finger and the shape edge line | 8mil | 10mil | |
113 |
Depth tolerance of depth-control groove milling |
±0.10mm | ±0.10mm | |
114 | Routing tolerance (edge to edge) | ±4mil | ±4mil | |
115 |
Min tolerance for routing slot (PTH) |
width/length tolerance ±0.13mm | width/length tolerance ±0.13mm | |
116 |
Min tolerance for routing slot (NPTH) |
width/length tolerance ±0.10mm | width/length tolerance ±0.10mm | |
117 |
Min tolerance for drilling slot (PTH) |
slotwidth±0.075mm;slotLength/slotwidth<2:slotLength+/- 0.1mm;slotLength/slotwidth≥2:slotLength+/-0.075mm | slotwidth±0.075mm;slotLength/slotwidth<2:slotLength+/-0.1mm; slotLength/slotwidth≥2:slotLength+/-0.075mm | |
118 |
Min tolerance for drilling slot (NPTH) |
slotwidth±0.05mm;slotLength/slotwidth<2:slotLength+/- 0.075mm;slotLength/slotwidth≥2:slotLength+/-0.05mm | slotwidth±0.05mm;slotLength/slotwidth<2:slotLength+/-0.075mm; slotLength/slotwidth≥2:slotLength+/-0.05mm | |
No | Capabilities(Order size/Delivery area <5m2) | Capabilities(Order size/Delivery area ≥5m2) | ||
119 | Local mixed pressur e |
Min gap between mechanical hole wall and conductor (Local mixed pressure area) |
≤10L:14mil;12L:15mil;>12L:18mil | ≤10L:14mil;12L:15mil;>12L:18mil |
120 |
Min gap between mechanical hole wall and the junction of local mixed pressure |
≤12L:12mil;>12L:15mil | ≤12L:12mil;>12L:15mil | |
No | Capabilities(Delivery area <5m2) | Capabilities(Delivery area ≥5m2) | ||
137 | Others | Max finished copper thickness to internal&external layer | inner Layer:10 OZ;outer layer:11 OZ | inner Layer:4 OZ;outer layer:5 OZ |
138 |
finished copper thickness to external layer |
12、18μmbase copper:≥35.8(reference value:35.8-42.5);≥ 40.4(reference value:40.4-48.5) |
12、18μmbase copper:≥35.8(reference value:35.8-42.5);≥40.4 (reference value:40.4-48.5) |
|
139 | 35、50、70μmbase copper:≥55.9;≥70;≥86.7 | 35、50、70μmbase copper:≥55.9;≥70;≥86.7 | ||
140 | 105、140μmbase copper:≥117.6;≥148.5 | 105、140μmbase copper:≥117.6;≥148.5 | ||
141 | Layer count | 1-40L | 1-20L | |
142 | PCB thickness | 0.20-7.0mm(no solder mask);0.40-7.0mm(with solder mask); | 0.3-5.0(no solder mask),0.4-5.0(with solder mask); | |
143 |
PCB thickness tolerance(Normal ) |
thickness±10%(>1.0mm);±0.1mm(≤1.0mm); | thickness±10%(>1.0mm);±0.1mm(≤1.0mm); | |
144 |
PCB thickness tolerance(Special ) |
thickness±0.1mm(≤2.0mm);±0.15mm(2.1-3.0mm) | thickness±10%(≤2.0mm);±0.15mm(2.1-3.0mm) | |
145 | Min finished PCB size | 10*10mm | 50*100mm | |
146 | Max finished PCB size | 24.5*47inch | 24*47inch | |
147 | ionic soil | ≤1ug/cm2 | ≤1ug/cm2 | |
148 | Min bow&twist |
0.3%(This ability request same laminated plate type, symmetry laminated construction, the difference of symmetry layer Copper area within 10%, uniformity wiring , excluding the large area of copper and base material ,haven't plate and single panel, and the long side size≤ 21 inch) |
0.75% | |
149 | Impedance tolerance | ±3Ω(<30Ω),±5%(≥60Ω),±7%(≥45Ω) | ±3Ω(<30Ω),±10%(≥30Ω); | |
150 |
Laser blind via size with filling plating |
4-5mil(priority4mil) | 4-5mil(priority 4mil) | |
151 |
Max aspect ratio for laser via filling plating |
1:1(Depth included copper thickness) |
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