Peltier Thermoelectric Cooling Modules
Peltier Thermoelectric Cooling Modules
Peltier Thermoelectric Cooling Modules
Peltier Thermoelectric Cooling Modules
Peltier Thermoelectric Cooling Modules
Peltier Thermoelectric Cooling Modules
Peltier Thermoelectric Cooling Modules
Peltier Thermoelectric Cooling Modules

1 / 6

Peltier Thermoelectric Cooling Modules

  • $150.00

    ≥100 Piece/Pieces

  • $140.00

    ≥1000 Piece/Pieces

Options:

  • 91*88*25.5 mm
Send Inquiry
Model No. : C11-01
Brand Name : FM
place of origin : China
Application : 1u Passive Solution
Socket Type : Fclga 3647 Narrow Ilm (Mounting Hole Spacing: 76*79*75.25 Mm)
Compatibility : Recommend For Intel® Xeon® Platinum / Gold Family Processor ( Products Formerly Skylake ), Socket Fclga3647 Narrow Ilm Only.
TDP : 165 W (* Note: The Application Environment Air Duct Needs To Be Matched)
Technology : Skiving Pure Copper
Overall Dimensions : 91*88*25.5 Mm
Weight : 576 G (Tips: The Weight Of The Radiator Is ≥500g. It Is Recommended That You Do Not Install It On The Cpu During Transportation To Avoid Damage To The Cpu.)
Thermal Interface Material : 7762(thermal Paste Area:68*45 Mm)
Packing : Industrial Package
More
5yrs

Dongguan, Guangdong, China

Visit The Store
  • Platform Certification
  • SGS Certification

Product description

FM produces various heat sinks / cold plates with technologies of CNC machining, aluminum extrusion, forging, friction stir
welding (FSW) and vacuum brazing.
The heat sinks can be produced with copper, aluminum alloy or laminated copper-aluminum, with nickel plating on surface for copper
or aluminum, or anodizing for aluminum.
The high performance heat sinks offer efficient way to manage electronic systems with highly concentrated power and heat.

Item Type:Copper Heatsink Manufacturer Copper skived Customized Copper Skiving Fin Heat sink


Material:Aluminum, Copper

Size:Standard or customized size

Shape:Round, Square, Flat, or customized

Thickness:0.4mm-20mm or Customized

Application:LED Lighting, Inverter, Welding Machine, Communication Device, Power Supply Equipment, Electronic Industry, Thermoelectric
Coolers/Generator, IGBT/UPS Cooling Systems, etc.

Production Process:Profiles Extruding-Cutting-CNC Machining(Milling, Drilling, Tapping)-Deburring- Cleaning- Inspecting-Packing
Finish:Anodizing, Mill finish, Electroplating, Polishing, Sandblasted, Powder coating, Silver plating, Brushed, Painted, PVDF, etc.

Deep process:CNC,drilling,milling,cutting,stamping,welding,bending,assembling,Custom Aluminum Fabrication

Tolerance:±0.01mm

Length:customized length

MOQ:Low MOQ

Packaging:standard export packaging or as discussed

OEM & ODM:Available. our engineer can check and discuss your design, great help!

Delivery time:15-20 days after sample confirmed & down payment, or negotiated.



Send Inquiry

Product Alert

Subscribe to your interested keywords. We will send freely the latest and hottest products to your Inbox. Don't miss any trade information.

版权所有 © 宁波全贸信息技术有限公司 浙ICP备12012821号-1 浙B2-20200628