low thermal coefficient aluminum nitride PCB sensor sheet

low thermal coefficient aluminum nitride PCB sensor sheet

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Aluninum Nitride Ceramic:

Aluminum nitride has high hardness and exceeds traditional alumina. It is a new type of wear-resistant ceramic material, but it can only be used for severely worn parts due to its high cost.
Using AIN ceramics for heat resistance, melt erosion and thermal shock resistance, GaAs crystal crucible, Al evaporating dish, magnetic fluid power generation device and high temperature turbine corrosion resistant parts can be fabricated, and its optical properties can be used as an infrared window. The aluminum nitride film Sic Ceramic Moulds can be made into a high frequency piezoelectric element, a very large scale integrated circuit substrate, or the like.
Aluminum nitride heat-resistant, resistant to molten metal erosion, stable to acid, but easy to be eroded in alkaline solution. The AIN fresh surface is exposed to moist air and reacts to form a very thin oxide film. By utilizing this property, it can be used as a crucible and a die-casting mold material for smelting metals such as aluminum, Sic Ceramic Moulds copper, silver, and lead. AIN ceramics have good metallization properties and can be widely used in the electronics industry as an alternative to toxic cerium oxide.

Data Sheet:

Ø (1) high thermal conductivity (about 320W / m · K), close to BeO and SiC, more than 5 times that of Al2O3;
Ø(2) The thermal expansion coefficient (4.5×10-6°C) is matched with Si (3.5-4×10-6°C) and GaAs (6×10-6°C);
Ø (3) excellent electrical properties (dielectric constant, dielectric loss, volume resistivity, dielectric strength);
Ø(4) good mechanical properties, higher flexural strength than Al2O3 and BeO ceramics, can be sintered at normal pressure;
Ø (5) good optical transmission characteristics;
Ø(6) non-toxic;

Application industry:

 Aluminum nitride powder has high purity, small particle size and high activity, and is the main raw material for manufacturing high thermal conductivity aluminum nitride ceramic substrate.
Aluminum nitride ceramic substrate, high thermal conductivity, low expansion coefficient, high strength, high temperature resistance, chemical corrosion resistance, high resistivity, small dielectric loss, is an ideal large-scale integrated circuit heat sink substrate and packaging materials.

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