Hybrid Package,electronic package housings,package housings,IC package

Product Description        Baienwei AlSi alloys include:Silicon content: 27%,42%,50%,60% and 70%, mainly used in electronic packaging field,playing outstanding performance in power electronic device package,
such as microwave high power devices,integrated circuit modules and T/R modules etc.As an electronic packaging material,AlSi alloy can be used in substrates,housings,carriers and lids, having a better compatibility and heat dissipation to prolong the working life of high power modules. AlSi alloys have the features such as light weight,(density 2.4—2.7g/cm³),high thermal conductivity,low CTE,high stiffness,excellent machinability,weldability,surface plating performance,hermeticity,high temperature resistance and corrosion resistance etc.        Baienwei adopts rapid solidification and subsequent machining technology, offering a series of electronic packaging services,including R&D,production,subsequent machining and plating.
Commonly Used Packaging Materials Performance Comparison

Material	Density g/cm³	Thermal Conductivity W/mK	CTE ppm/ºC	Plateability	Machinability	Weldability	Formability
Copper	8.9	385	16	Good	Good	Good	Good
Titanium	4.5	17	8.9	Fair	Fair	Fair	Fair
Al6061	2.7	210	22.6	Good	Good	Good	Good
Kovar	8.4	15	6.0	Good	Good	Good	Good
Cu85%W	16.4	180	6.8	Fair	Fair	Fair	Fair
Cu85%Mo	10.0	165	6.8	Fair	Fair	Fair	Fair
Al65%SiC	3.0	170	6.8	Poor	Poor	Poor	Poor
AlSi27	2.6	175	17	Good	Good	Good	Good
AlSi50	2.5	140	11.5	Good	Good	Good	Good

  AlSi Alloy Electronic Packaging:   Microelectronic Package Optoelectronic Package Fiber Optic & Telecom Package T/R Modules Hybrid Package   Company Information Tianjin Baienwei New Material Technology Co., Ltd is a professional high-tech manufacturer with a collection of R&D, production and sales. Since 2006, the company has cooperated with National Academy of Sciences and famous institutes to set up a new material development lab. The company adopts advanced spraying forming technology and specializes in the production of silicon aluminium alloy(CE alloy). Our main products include:silicon aluminum alloy(AlSi Controlled Expansion alloy) raw material,electronic packaging housings,automobile engine cylinder liners,pistons and brake discs,which are widely used in various high-end fields,such as aerospace,military industry,automotive industry,machinery and heavy industry etc.The material is Homogenous and stable, which is applied to various electronic packaging and related electronic products. At the same time, we can also provide customized products according to customer's requirements. The company is located near Tianjin Port, water, land and air transportation is very convenient. The company holds the managerial idea that ‘Quality Proves Strength, Details Reach to Success’, and tries its best to do well at any aspect from each stitch, from each point of procedure of manufacturing to final inspection, packing and shipment. If you are interested in our products or would like to discuss a custom order, please feel free to contact us. We are looking forward to forming successful business relationships with new clients around the world in the near future. FAQ      1. What is silicon-aluminum alloy? Silicon-aluminum alloy is a kind of binary alloy consisting of silicon and aluminum, in which the content of silicon ranges from 20% to 85%.      2. Is there any other element in silicon-aluminum alloy? As alloy is not produced with extremely pure component, our alloy product contains the impurities which are common in commercial aluminum alloy. These impurities include iron, copper, magnesium, titanium, gallium, etc. However, the total content of these impurities is generally smaller than 1%, which will not negatively affect the performance of alloy.          3. What are the advantages of this alloy? This silicon-aluminum alloy has advantages of light weight, low thermal expansion, high thermal conductivity, which can be processed, electroplated and welded in normal procedure. These special properties cannot be provided in any other material.        4. Applications: This alloy can be treated as the low thermal expansion aluminum alloy. a. If the thermal expansion of traditional aluminum alloy is high, it can replace traditional aluminum alloy; b. It can replacesome low thermal expansion materials, e.g.: KOVAR with relatively heavy weight; c. It can replacethe materials with low thermal expansion and high thermal conductivity, e.g.: copper-molybdenum, copper-        tungsten and copper, and the weight of these materialsis a problem; d. It can replacethe standard aluminum alloy because of stronger rigidity; e. If there is requirement of structure stability, it can be combined with the property of metals and ceramic materials and operated within some extent of temperature range.