Product description
Board thicknesses: 0.8 to 3.0 mm
Copper thickness: 1.5 oz
Special technique: blind and buried via + impedance control
Material: rigid PCB (FR4, CEM-3, aluminum, metal core PCB)
Surface treatment: HASL/ HASL lead-free, chemical tin, chemical gold, Immersion silver/gold, OSP, gold plating
0.1mm on integrated circuit parts with SO, SOP, SOJ, TSSOP, QFP and BGA
Inspection online for AOI and ICT test
X-ray inspection for BGA